Abstract: A continuous loop of thermally conductive material is provided with a first portion in frictional contact with a casing of an electronic device and a second portion located within a cooling region. The loop is advanced such that the first portion is located within the cooling region and the second portion is in frictional contact with the casing.

Abstract: A continuous loop of thermally conductive material is provided with a first portion in frictional contact with a casing of an electronic device and a second portion located within a cooling region. The loop is advanced such that the first portion is located within the cooling region and the second portion is in frictional contact with the casing.

Abstract: An electrical connector system for mitigating corrosion and maintaining an internal environment conducive for connectivity and the protection of internal electrical contacts is disclosed. The electrical system can include a female connector device designed to couple with a male connector device, and to enclose a chamber containing a corrosion deterring fluid. One or more electrical contacts can be located within the chamber, and be configured to interface with connecting members of a male connector device. The electrical connector system can also include one or more sealing gates configured to act as a sealing membrane that is designed to separate the corrosion deterring fluid in the chamber from fluid external to the chamber while allowing the connecting members of the male connector device to be inserted through the gates and into the chamber.

Abstract: A method includes rotating a first elongated, inlet-side member of an air valve toward an open configuration when a fan blade is rotating and rotating the first inlet-side member to toward a closed configuration when the fan blade is not rotating. The air valve includes a frame and a sheet of thin material. The frame may have an outlet-side member configured to be mounted on a fan housing and the inlet-side member rotatably coupled to the outlet-side member. The material may have top and bottom edges, and a plurality of folds perpendicular to the top and bottom side edges that divide the sheet into a plurality of sections. The material may be attached to the outlet-side member and the inlet-side member, and configurable between folded and expanded positions.

Abstract: A method and apparatus are provided for implementing microscale thermoacoustic heat and power control for processors and three dimensional (3D) chip stacks. A thermoacoustic heat engine is integrated with a 3D chip-stack and high power processors. The thermoacoustic heat engine is used in cooperation with a heat sink associated with the 3D chip-stack. Predefined connecting layers connect the 3D chip-stack to a cooling end of a thermoacoustic stack of the thermoacoustic heat engine, allowing the cooled end of the resonator to maintain temperature within the 3D chip-stack and to increase the efficiency of the heat sink.

Abstract: A method and system for a dynamic keying system is disclosed. The method and system can include a male connector device having a first plurality of settings for one or more key features, and a female connector device having a second plurality of settings for one or more key features. The female connector device can be configured to operate in an initial mode in which it is configured to, in response to the introduction of the male connector device, correspond a first setting of the first plurality of settings to a second setting of the second plurality of settings. The female connector device can also be configured to operate in a subsequent mode, in which it can permit coupling with at least one male connector device having the first setting and consistently deny access to at least one male connector device having a third setting different than the first setting.

Abstract: A method and system for a dynamic keying system is disclosed. The method and system can include a male connector device having a first plurality of settings for one or more key features, and a female connector device having a second plurality of settings for one or more key features. The female connector device can be configured to operate in an initial mode in which it is configured to, in response to the introduction of the male connector device, correspond a first setting of the first plurality of settings to a second setting of the second plurality of settings. The female connector device can also be configured to operate in a subsequent mode, in which it can permit coupling with at least one male connector device having the first setting and consistently deny access to at least one male connector device having a third setting different than the first setting.

Abstract: An air valve includes a frame and a sheet of thin material. The frame may have an outlet-side member configured mounted on a fan housing and an inlet-side member rotatably coupled to the outlet-side member. The material may have top and bottom edges, and a plurality of folds perpendicular to the top and bottom side edges that divide the sheet into a plurality of sections. The material may be attached to the outlet-side member and the inlet-side member, and configurable between folded and expanded positions. An attraction between a magnetic component on the inlet-side member and a magnetic component on a rotating fan blade may cause the inlet-side member to rotate, moving the material into the folded configuration. When the fan blade is not rotating, a spring attached at a pivot point may cause the inlet-side member to rotate in an opposite direction, moving the material into the expanded position.

Abstract: A continuous loop of thermally conductive material is provided with a first portion in frictional contact with a casing of an electronic device and a second portion located within a cooling region. The loop is advanced such that the first portion is located within the cooling region and the second portion is in frictional contact with the casing.

Abstract: A continuous loop of thermally conductive material is provided with a first portion in frictional contact with a casing of an electronic device and a second portion located within a cooling region. The loop is advanced such that the first portion is located within the cooling region and the second portion is in frictional contact with the casing.

Abstract: A cooling apparatus is disclosed, which may include multiple heat producing units. The cooling apparatus may also have a thermal interface material (TIM) to facilitate heat transfer away from the heat producing units. The cooling apparatus may also have multiple heat sink columns located above, and designed to conduct heat away from, corresponding heat producing units, through thermally conductive contact with corresponding portions of the TIM layer. The cooling apparatus may also have a load plate located above the heat sink columns, designed to hold the heat sink columns in a relatively fixed position above the heat producing units. The TIM layer may have an initial compressed state between the heat sink columns and the corresponding heat producing units. Each of the heat sink columns may be designed so that, in operation, the corresponding portion of the TIM layer may have a further compressed state.

Abstract: A cooling apparatus is disclosed, which may include multiple heat producing units. The cooling apparatus may also have a thermal interface material (TIM) to facilitate heat transfer away from the heat producing units. The cooling apparatus may also have multiple heat sink columns located above, and designed to conduct heat away from, corresponding heat producing units, through thermally conductive contact with corresponding portions of the TIM layer. The cooling apparatus may also have a load plate located above the heat sink columns, designed to hold the heat sink columns in a relatively fixed position above the heat producing units. The TIM layer may have an initial compressed state between the heat sink columns and the corresponding heat producing units. Each of the heat sink columns may be designed so that, in operation, the corresponding portion of the TIM layer may have a further compressed state.

Abstract: A method and apparatus are provided for implementing redundant and high efficiency hybrid liquid and air cooling for chipstacks. The apparatus includes an electronic module having a chipstack of one or more semiconductor chips; a liquid heat sink lid over the chipstack; an inlet flow and an outlet flow enabling a low viscosity dielectric liquid to pass through the lid and around the chipstack of the electronic module; a top of said electronic module providing an airflow heat sink support surface for airflow cooling used in parallel to under-lid liquid cooling.

Abstract: According to embodiments of the invention, an electronic component assembly may be provided. The electronic component assembly may include an electronic component body. The electronic component assembly may also include one or more elastic members affixed to the electronic component body. The electronic component assembly may also include a catch mechanism affixed to each elastic member adapted to allow insertion of the elastic member and the catch mechanism through a hole of a circuit board in an extended position, and upon release from the extended position, hold the electronic component body in a fixed position by the tension of the elastic member and the catch mechanism grasping an edge of a surface of the circuit board opposite a surface upon which the electronic component body rests.

Abstract: A management system in a distributed cloud environment that includes a plurality of cloud object, may administer shared page access control among cloud objects. Such shared access control includes: receiving, by the management system from a requesting cloud object, a request to access a shared page; discovering, by the management system, one or more page attributes of the shared page, where the one or more page attributes of the shared page include attributes specified by one or more cloud objects of the distributed cloud environment; identifying, by the management system in dependence upon the page attributes, one more access control measures to perform; performing, by the management system in dependence upon the page attributes, the access control measures; and determining, by the management system, whether to grant the requesting cloud object access to the shared page.

Abstract: Managing cooling operations in a parallel computer comprising a plurality of compute nodes, including: receiving, by a target compute node from an origin compute node, a message; identifying, by the target compute node, one or more characteristics of the message; and controlling, by the target compute node, cooling operations in dependence upon the one or more characteristics of the message.

Abstract: An electrical connector system for mitigating corrosion and maintaining an internal environment conducive for connectivity and the protection of internal electrical contacts is disclosed. The electrical system can include a female connector device designed to couple with a male connector device, and to enclose a chamber containing a corrosion deterring fluid. One or more electrical contacts can be located within the chamber, and be configured to interface with connecting members of a male connector device. The electrical connector system can also include one or more sealing gates configured to act as a sealing membrane that is designed to separate the corrosion deterring fluid in the chamber from fluid external to the chamber while allowing the connecting members of the male connector device to be inserted through the gates and into the chamber.

Abstract: An apparatus that is a receptacle adapted for receiving a connector. The apparatus may further include a hinged heat sink included in the receptacle. The hinged heat sink adapted in an open position for insertion and removal of a cable. The hinged heat sink further adapted in a closed position to make thermal contact with a thermally active location of the connector wherein a thermal path is provided for a dissipation point on the outside of the electronic receptacle.

Abstract: An apparatus includes a component bay having an operational height and an expanded height. The component bay is moveable between the operational height and the expanded height. A thermal element divides the component bay into one or more compartments, each compartment configured to receive a system component. The component bay at the operational height provides thermal contact between the received system component and the thermal element.

Abstract: According to embodiments of the invention, a structure for cooling electronic components may be provided. The structure may include a heat sink having a plurality of parallel heat conducting elements. The structure may also include a plurality of fans, wherein the fans are interleaved with the heat conducting elements. The structure may also include a drive shaft passing through the heat conducting elements and the fans, wherein the drive shaft rotates the fans in relation to the heat sink. According to other embodiments, the structure may include a baffle located on a side of the heat sink in an upstream location within an airflow stream.