Patents by Inventor Phillip W. Carter
Phillip W. Carter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11851584Abstract: The invention provides a chemical-mechanical polishing composition comprising (a) an abrasive, (b) a cobalt accelerator, and (c) an oxidizing agent that oxidizes a metal, wherein the polishing composition has a pH of about 4 to about 10. The invention further provides a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate contains cobalt.Type: GrantFiled: July 13, 2017Date of Patent: December 26, 2023Assignee: CMC MATERIALS, INC.Inventors: Steven Kraft, Phillip W. Carter, Andrew R. Wolff
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Publication number: 20230157589Abstract: A system includes a sensor applicator, a sensor control device arranged within the sensor applicator and including an electronics housing and a sensor extending from a bottom of the electronics housing, and a cap coupled to one of the sensor applicator and the sensor control device, wherein the cap is removable prior to deploying the sensor control device from the sensor applicator.Type: ApplicationFiled: January 9, 2023Publication date: May 25, 2023Applicant: ABBOTT DIABETES CARE INC.Inventors: Christopher A. Thomas, Louis Pace, Dhamendra Patel, Vincent M. Dipalma, Vivek S. Rao, Steven T. Mitchell, Byron J. Lambert, Peter G. Robinson, Peter M. Voit, Stephen T. Pudjijanto, Matthew Simmons, Hsuehchieh Wu, Vu H. Le, Johnathan D. Manion, Christopher M. Harris, Tuan Nguyen, Phillip W. Carter, Jonathan D. Mccanless
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Publication number: 20230157590Abstract: A system includes a sensor applicator, a sensor control device arranged within the sensor applicator and including an electronics housing and a sensor extending from a bottom of the electronics housing, and a cap coupled to one of the sensor applicator and the sensor control device, wherein the cap is removable prior to deploying the sensor control device from the sensor applicator.Type: ApplicationFiled: January 9, 2023Publication date: May 25, 2023Applicant: ABBOTT DIABETES CARE INC.Inventors: Christopher A. Thomas, Louis Pace, Dharmendra Patel, Vincent M. Dipalma, Vivek S. Rao, Steven T. Mitchell, Byron J. Lambert, Peter G. Robinson, Peter M. Voit, Stephen T. Pudjijanto, Matthew Siimmons, Hsuehchieh Wu, Vu H. Le, Johnathan D. Manion, Christopher M. Harris, Tuan Nguyen, Phillip W. Carter, Jonathan D. Mccanless
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Publication number: 20220167919Abstract: An assembly and method for delivery of an analyte sensor including a reusable applicator having a proximal portion and a distal portion are disclosed. The reusable applicator can include a housing, a sensor carrier configured to releasably receive the first analyte sensor, a sharp carrier configured to releasably receive a sharp module, and an actuator movable relative to the housing.Type: ApplicationFiled: August 27, 2021Publication date: June 2, 2022Inventors: Vivek S. Rao, Anthony Lin Chern, Phillip W. Carter, Joshua Lindsay, Tuan Nguyen, Vincent M. DiPalma
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Publication number: 20220125480Abstract: An assembly and method for delivery of an analyte sensor including a reusable applicator having a proximal portion and a distal portion are disclosed. The reusable applicator can include a housing, a sensor carrier configured a sensor carrier configured to releasably receive a first analyte sensor, a sharp carrier configured to releasably receive a sharp module and movable between the proximal portion of the reusable applicator and the distal portion of the reusable applicator for delivery of the first analyte sensor from the reusable applicator, and a reset tool configured to reset the reusable applicator for delivery of another analyte sensor.Type: ApplicationFiled: August 11, 2021Publication date: April 28, 2022Inventors: Vivek S. Rao, Anthony Lin Chern, Phillip W. Carter, Joshua Lindsay, Tuan Nguyen
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Publication number: 20200196919Abstract: Systems, devices and methods are provided for inserting at least a portion of an in vivo analyte sensor for sensing an analyte level in a bodily fluid of a subject. In particular, disclosed herein are various embodiments of applicators, and components thereof, designed to reduce trauma to tissue of a sensor insertion site and to increase the likelihood of a successful sensor insertion. Also disclosed are embodiments to ensure structural integrity of a sensor.Type: ApplicationFiled: June 6, 2019Publication date: June 25, 2020Inventors: Vivek S. Rao, Vincent M. DiPalma, Phillip W. Carter, Hsueh-chieh Wu, Jonathan D. McCanless, Steven T. Mitchell, Udo Hoss, Peter G. Robinson, Andrew H. Naegeli, Stephen T. Pudjijanto, Allan C. Buenconsejo, Michelle Hwang, Matthew Simmons
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Patent number: 10124464Abstract: The invention provides methods of inhibiting corrosion of a substrate containing metal. The substrate can be in any suitable form. In some embodiments, the metal is cobalt. The methods can be used with semiconductor wafers in some embodiments. The invention also provides chemical-mechanical polishing compositions and methods of polishing a substrate. A corrosion inhibitor can be used in the methods and compositions disclosed herein. The inhibitor comprises an amphoteric surfactant, a sulfonate, a phosphonate, a carboxylate, an amino acid derivative, a phosphate ester, an isethionate, a sulfate, a sulfosuccinate, a sulfocinnimate, or any combination thereof.Type: GrantFiled: October 21, 2015Date of Patent: November 13, 2018Assignee: Cabot Microelectronics CorporationInventors: Mary Cavanaugh, Steven Kraft, Andrew Wolff, Phillip W. Carter, Elise Sikma, Jeffrey Cross, Benjamin Petro
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Publication number: 20180016469Abstract: The invention provides a chemical-mechanical polishing composition comprising (a) an abrasive, (b) a cobalt accelerator, and (c) an oxidizing agent that oxidizes a metal, wherein the polishing composition has a pH of about 4 to about 10. The invention further provides a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate contains cobalt.Type: ApplicationFiled: July 13, 2017Publication date: January 18, 2018Inventors: Steven KRAFT, Phillip W. CARTER, Andrew R. WOLFF
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Patent number: 9850403Abstract: The invention provides a chemical-mechanical polishing composition comprising (a) abrasive particles, (b) a cobalt accelerator selected from a compound having the formula: NR1R2R3 wherein R1, R2, and R3 are independently selected from hydrogen, carboxyalkyl, substituted carboxyalkyl, hydroxyalkyl, substituted hydroxyalkyl and aminocarbonylalkyl, wherein none or one of R1, R2, and R3 are hydrogen; dicarboxyheterocycles; heterocyclylalkyl-?-amino acids; N-(amidoalkyl)amino acids; unsubstituted heterocycles; alkyl-substituted heterocycles; substituted-alkyl-substituted heterocycles; N-aminoalkyl-?-amino acids; and combinations thereof, (c) a cobalt corrosion inhibitor, (d) an oxidizing agent that oxidizes a metal, and (e) water, wherein the polishing composition has a pH of about 3 to about 8.5. The invention further provides a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate contains cobalt.Type: GrantFiled: May 24, 2017Date of Patent: December 26, 2017Assignee: Cabot Microelectronics CorporationInventors: Steven Kraft, Andrew Wolff, Phillip W. Carter, Kristin Hayes, Benjamin Petro
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Patent number: 9834704Abstract: The invention provides a chemical-mechanical polishing composition comprising (a) abrasive particles, (b) a cobalt corrosion inhibitor, (c) a cobalt dishing control agent, wherein the cobalt dishing control agent comprises an anionic head group and a C13-C20 aliphatic tail group, (d) an oxidizing agent that oxidizes cobalt, and (e) water, wherein the polishing composition has a pH of about 3 to about 8.5. The invention further provides a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate contains cobalt.Type: GrantFiled: October 21, 2015Date of Patent: December 5, 2017Assignee: Cabot Microelectronics CorporationInventors: Steven Kraft, Andrew Wolff, Phillip W. Carter, Benjamin Petro
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Publication number: 20170260421Abstract: The invention provides a chemical-mechanical polishing composition comprising (a) abrasive particles, (b) a cobalt accelerator selected from a compound having the formula: NR1R2R3 wherein R1, R2, and R3 are independently selected from hydrogen, carboxyalkyl, substituted carboxyalkyl, hydroxyalkyl, substituted hydroxyalkyl and aminocarbonylalkyl, wherein none or one of R1, R2, and R3 are hydrogen; dicarboxyheterocycles; heterocyclylalkyl-?-amino acids; N-(amidoalkyl)amino acids; unsubstituted heterocycles; alkyl-substituted heterocycles; substituted-alkyl-substituted heterocycles; N-aminoalkyl-?-amino acids; and combinations thereof, (c) a cobalt corrosion inhibitor, (d) an oxidizing agent that oxidizes a metal, and (e) water, wherein the polishing composition has a pH of about 3 to about 8.5. The invention further provides a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate contains cobalt.Type: ApplicationFiled: May 24, 2017Publication date: September 14, 2017Inventors: Steven KRAFT, Andrew WOLFF, Phillip W. CARTER, Kristin HAYES, Benjamin PETRO
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Publication number: 20170194160Abstract: Disclosed is a method of chemically-mechanically polishing a substrate. The method comprises, consists of, or consists essentially of (a) contacting a substrate containing a low-k dielectric composition, which includes less than about 80% by weight of carbon, with a polishing pad and a chemical-mechanical polishing composition comprising water and abrasive particles having a positive surface charge, wherein the polishing composition has a pH of from about 3 to about 6; (b) moving the polishing pad and the chemical-mechanical polishing composition relative to the substrate; and (c) abrading at least a portion of the substrate to polish the substrate. In some embodiments, the low-k dielectric composition is carbon-doped silicon oxide.Type: ApplicationFiled: January 6, 2017Publication date: July 6, 2017Inventors: Sudeep PALLIKKARA KUTTIATOOR, Renhe JIA, Kuen-Min CHEN, Steven KRAFT, Phillip W. CARTER
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Patent number: 9688885Abstract: The invention provides a chemical-mechanical polishing composition comprising (a) abrasive particles, (b) a cobalt accelerator selected from a compound having the formula: NR1R2R3 wherein R1, R2, and R3 are independently selected from hydrogen, carboxyalkyl, substituted carboxyalkyl, hydroxyalkyl, substituted hydroxyalkyl and aminocarbonylalkyl, wherein none or one of R1, R2, and R3 are hydrogen; dicarboxyheterocycles; heterocyclylalkyl-?-amino acids; N-(amidoalkyl)amino acids; unsubstituted heterocycles; alkyl-substituted heterocycles; substituted-alkyl-substituted heterocycles; N-aminoalkyl-?-amino acids; and combinations thereof, (c) a cobalt corrosion inhibitor, (d) an oxidizing agent that oxidizes a metal, and (e) water, wherein the polishing composition has a pH of about 3 to about 8.5. The invention further provides a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate contains cobalt.Type: GrantFiled: October 21, 2015Date of Patent: June 27, 2017Assignee: Cabot Microelectronics CorporationInventors: Steven Kraft, Andrew Wolff, Phillip W. Carter, Kristin Hayes, Benjamin Petro
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Patent number: 9528030Abstract: The invention provides a chemical-mechanical polishing composition that contains (a) abrasive particles, (b) an azole compound having an octanol-water log P of about 1 to about 2, (c) a cobalt corrosion inhibitor, wherein the cobalt corrosion inhibitor comprises an anionic head group and a C8-C14 aliphatic tail group, (d) a cobalt accelerator, (e) an oxidizing agent that oxidizes cobalt, and (f) water, wherein the polishing composition has a pH of about 3 to about 8.5. The invention further provides a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate contains cobalt.Type: GrantFiled: October 21, 2015Date of Patent: December 27, 2016Assignee: Cabot Microelectronics CorporationInventors: Steven Kraft, Phillip W. Carter, Jason Seabold
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Publication number: 20160115353Abstract: The invention provides a chemical-mechanical polishing composition comprising (a) abrasive particles, (b) a cobalt accelerator selected from a compound having the formula: NR1R2R3 wherein R1, R2, and R3 are independently selected from hydrogen, carboxyalkyl, substituted carboxyalkyl, hydroxyalkyl, substituted hydroxyalkyl and aminocarbonylalkyl, wherein none or one of R1, R2, and R3 are hydrogen; dicarboxyheterocycles; heterocyclylalkyl-?-amino acids; N-(amidoalkyl)amino acids; unsubstituted heterocycles; alkyl-substituted heterocycles; substituted-alkyl-substituted heterocycles; N-aminoalkyl-?-amino acids; and combinations thereof, (c) a cobalt corrosion inhibitor, (d) an oxidizing agent that oxidizes a metal, and (e) water, wherein the polishing composition has a pH of about 3 to about 8.5. The invention further provides a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate contains cobalt.Type: ApplicationFiled: October 21, 2015Publication date: April 28, 2016Inventors: Steven Kraft, Andrew Wolff, Phillip W. Carter, Kristin Hayes, Benjamin Petro
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Publication number: 20160107289Abstract: The invention provides methods of inhibiting corrosion of a substrate containing metal. The substrate can be in any suitable form. In some embodiments, the metal is cobalt. The methods can be used with semiconductor wafers in some embodiments. The invention also provides chemical-mechanical polishing compositions and methods of polishing a substrate. A corrosion inhibitor can be used in the methods and compositions disclosed herein. The inhibitor comprises an amphoteric surfactant, a sulfonate, a phosphonate, a carboxylate, an amino acid derivative, a phosphate ester, an isethionate, a sulfate, a sulfosuccinate, a sulfocinnimate, or any combination thereof.Type: ApplicationFiled: October 21, 2015Publication date: April 21, 2016Inventors: Mary Cavanaugh, Steven Kraft, Andrew Wolff, Phillip W. Carter, Elise Sikma, Jeffrey Cross
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Publication number: 20160108285Abstract: The invention provides a chemical-mechanical polishing composition comprising (a) abrasive particles, (b) a cobalt corrosion inhibitor, (c) a cobalt dishing control agent, wherein the cobalt dishing control agent comprises an anionic head group and a C13-C20 aliphatic tail group, (d) an oxidizing agent that oxidizes cobalt, and (e) water, wherein the polishing composition has a pH of about 3 to about 8.5. The invention further provides a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate contains cobalt.Type: ApplicationFiled: October 21, 2015Publication date: April 21, 2016Inventors: Steven Kraft, Andrew Wolff, Phillip W. Carter
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Patent number: 8637404Abstract: The invention provides methods for planarizing or polishing a metal surface. The method comprises a composition comprising an abrasive, cesium ions, and a liquid carrier comprising water.Type: GrantFiled: November 23, 2010Date of Patent: January 28, 2014Assignee: Cabot Microelectronics CorporationInventors: Phillip W. Carter, Shoutian Li
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Patent number: 8551202Abstract: The invention provides compositions and methods for planarizing or polishing a substrate. The composition comprises an abrasive, iodate ion, a nitrogen-containing compound selected from the group consisting of a nitrogen-containing C4-20 heterocycle and a C1-20 alkylamine, and a liquid carrier comprising water.Type: GrantFiled: March 23, 2006Date of Patent: October 8, 2013Assignee: Cabot Microelectronics CorporationInventors: Shoutian Li, Phillip W. Carter, Jian Zhang
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Patent number: 8497209Abstract: The present invention provides a chemical-mechanical polishing (CMP) composition comprising an amino compound, a radical-forming oxidizing agent, a radical trapping agent capable of inhibiting radical-induced oxidation of the amino compound, and an aqueous carrier therefore. The radical trapping agent is a hydroxyl-substituted polyunsaturated cyclic compound, a nitrogenous compound, or a combination thereof. Optionally, the composition comprises a metal oxide abrasive (e.g., silica, alumina, titania, ceria, zirconia, or a combination of two or more of the foregoing abrasives).Type: GrantFiled: April 21, 2010Date of Patent: July 30, 2013Assignee: Cabot Microelectronics CorporationInventors: Steven K. Grumbine, Renjie Zhou, Zhan Chen, Phillip W. Carter