Patents by Inventor Phillip W. Sheeley

Phillip W. Sheeley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for testing semiconductor integrated circuit devices in wafer form
    Patent number: 6876215
    Abstract: Apparatus for testing semiconductor integrated circuit devices in wafer form includes a test head, a probe card support mechanism attached to the test head for supporting a probe card beneath the test head, a wafer prober for presenting successive wafers to be tested to the test head from beneath the test head, and a lifting mechanism attached to the wafer prober for lifting the test head above the wafer prober. Upon lifting the test head above the wafer prober, the probe card support mechanism can move horizontally relative to the test head between an inserted position in which the probe card support mechanism is positioned to enable the probe card to engage contact elements of the test head and an extended position in which the probe card can be removed from the probe card support mechanism.
    Type: Grant
    Filed: February 27, 2003
    Date of Patent: April 5, 2005
    Assignee: Credence Systems Corporation
    Inventors: James M. Hannan, John J. Harsany, James R. Jordan, Phillip W. Sheeley