Abstract: Techniques and apparatus for are described. In one embodiment, for example, an apparatus may include at least one memory, and logic coupled to the at least one memory. The logic may be configured to perform an analytical service on a primary analytical device, receive acceptance of the analytical service, and generate an analytical services package for the analytical service, the analytical services package configured to facilitate performance of the analytical service on a client analytical device. Other embodiments are described.

Abstract: Techniques and apparatus for ion source devices with minimized post-column volumes are described. In one embodiment, for example, an apparatus may include at least one memory, and logic coupled to the at least one memory. The logic may be configured to receive analytical information from at least one analytical instrument, and generate at least one record in a distributed ledger having a transaction associated with at least a portion of the analytical information. Other embodiments are described.

Abstract: Techniques and apparatus for are described. In one embodiment, for example, an apparatus may include at least one memory, and logic coupled to the at least one memory. The logic may be configured to perform an analytical service on a primary analytical device, receive acceptance of the analytical service, and generate an analytical services package for the analytical service, the analytical services package configured to facilitate performance of the analytical service on a client analytical device. Other embodiments are described.

Abstract: Techniques and apparatus for ion source devices with minimized post-column volumes are described. In one embodiment, for example, an apparatus may include at least one memory, and logic coupled to the at least one memory. The logic may be configured to receive analytical information from at least one analytical instrument, and generate at least one record in a distributed ledger having a transaction associated with at least a portion of the analytical information. Other embodiments are described.

Abstract: The invention relates to a cantilever releasable lock mechanism for selectively adjusting the height of a support platform with respect to a reference level and to adjust the angular attitude of the support platform. The mechanism consists of a housing, a carriage member having a first end and a second end where the first end is pivotally attached to the housing, a spreader member that may be axially displaced with respect to the carriage member bi-axially depending upon the direction of rotation of a support platform that is pivotally attached to the carriage member at its second end. Displacement of the spreader member in one direction urges a clutch member to apply bearing stress that locks the carriage member rotationally to the housing and in the other direction relieves the bearing stress and unlocks the mechanism.

Abstract: A bearing assembly with a bearing for a rotating element, a bearing assembly housing and a bearing liner inserted between the bearing housing and the bearing liner that has an annular channel that contains an anti-rotation and dampening element and extends from an inner surface of the liner through at least the thickness of the liner.

Abstract: A bearing failure detection system includes a thermal protector switch circuit having a wear strip located within an interior of a motor stator. In response to bearing failure or wear above a predetermined magnitude, the motor rotor will shift off its axis of rotation and wear away the wear strip or break the electrically conducting material of the wear strip and activate the stator thermal protector switch circuit and shut down the electric motor. The wear strips assist the thermal protector switch circuit in the identification of a bearing failure and the light rubbing that results therefrom prior to the generation of an electrical burning smell that may otherwise occur after a prolonged period of rubbing.

Abstract: A configuration circuit includes a latch and a dedicated non-volatile memory cell. The non-volatile memory cell is initially programmed or erased. The latch is then set to store a first logic value by coupling the latch to a first voltage supply terminal in response to an activated control signal. When the control signal is de-activated, the latch is de-coupled from the first voltage supply terminal and coupled to the non-volatile memory cell. If the non-volatile memory cell is programmed, the latch is coupled to a second voltage supply terminal, thereby storing a second logic value in the latch. If the non-volatile memory cell is erased, the latch is isolated from the second voltage supply terminal, and the first logic value remains stored in the latch. The latch can also be directly written through one or more access transistors, thereby facilitating testing.

Abstract: This invention is an improved tilt lock device for chairs having a spindle and piston for raising and lowering the chair. The improvement consists of a pawl plate for engagement with the piston where the pawl plate is integral with a locking shaft that extends from the chair. The pawl plate contains a barrier rib that is disposed in the upper surface of the plate and is compressively biased by a torsion spring extension. Axial displacement of the locking shaft is precluded when the torsion spring is in bias engagement with the barrier rib. To overcome the bias, the locking shaft requires the application of an axial external force and remains locked until such force overcomes the bias of the barrier rib.

Abstract: A process to remove a semiconductor die from a plastic package and then to reassemble the die in a high reliability hermetic package. The process is used to remove an already existing die using a unique disassembly and etching process and make the removed die more reliable by reattaching the die and rebonding all new die wires into either a hermetic package or a different type of package with a “bond-on-top-of-bond” technique. The original bondfoot on the removed die may be first preconditioned by a novel bond-flattening tool, which can be attached to the bond-head chuck of any wirebonder. Also, the die can be used in other applications with different pin-outs or configurations.