Patents by Inventor Phillipe Lance

Phillipe Lance has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9927266
    Abstract: A multi-die sensor system comprises a package and one or more transducer dies mounted in the package. Each transducer die includes one or more transducers, a temperature control element, and temperature sensor. The temperature control element changes the temperature of at least a portion of the transducer during operation of the temperature control element. A temperature sensor senses the temperature of at least the portion of the transducer. An output circuitry die mounted in the package receives transducer signals and a sensed temperature signal from the temperature sensor.
    Type: Grant
    Filed: February 27, 2012
    Date of Patent: March 27, 2018
    Assignee: NXP USA, Inc.
    Inventors: Chad S. Dawson, Phillipe Lance, Yizhen Lin, Mark E. Schlarmann
  • Publication number: 20140376586
    Abstract: A multi-die sensor system comprises a package and one or more transducer dies mounted in the package. Each transducer die includes one or more transducers, a temperature control element, and temperature sensor. The temperature control element changes the temperature of at least a portion of the transducer during operation of the temperature control element. A temperature sensor senses the temperature of at least the portion of the transducer. An output circuitry die mounted in the package receives transducer signals and a sensed temperature signal from the temperature sensor.
    Type: Application
    Filed: February 27, 2012
    Publication date: December 25, 2014
    Applicant: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Chad S. Dawson, Phillipe Lance, Yizhen Lin, Mark E. Schlarmann