Patents by Inventor Phillipp LORENZ

Phillipp LORENZ has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HIGH-TEMPERATURE GREASE
    Publication number: 20250019614
    Abstract: The invention relates to a high-temperature grease comprising (A) 20 to 88 wt %, based on the overall weight of the grease, of a base oil, (B) 1 to 55 wt. %, based on the overall weight of the grease, of a fluorine-free material, said fluorine-free material having an average particle size (D50) of less than 80 ?m wherein the grease does not contain polytetrafluorothylene and/or contains polytetrafluorothylene in a proportion of less than 4 wt. %, based on the overall weight of the grease.
    Type: Application
    Filed: November 21, 2022
    Publication date: January 16, 2025
    Inventors: Martin SCHWEIGKOFLER, Martin SCHMIDT-AMELUNXEN, Thomas KILTHAU, Karl EGERSDOERFER, Daniel CHALL, Christof SCHMITZ, Phillipp LORENZ, Petra SEIBEL, Tilman KRAUCH
  • Mobile power tool and method
    Patent number: 12138769
    Abstract: A mobile power tool comprising a drive unit is disclosed. The drive unit has an aqueous lubricant and/or the drive unit is set up for operation with the aqueous lubricant, wherein, before the start of a running-in phase of the drive unit, a bond roughness sigma of two interacting contact surfaces of the drive unit is greater than 0.01 ?m, preferably at least 0.1 ?m.
    Type: Grant
    Filed: November 26, 2021
    Date of Patent: November 12, 2024
    Assignee: Hilti Aktiengesellschaft
    Inventors: Jens Kondratiuk, Phillipp Lorenz, Balasubramaniam Vengudusamy, Stefan Seemeyer
  • Wafer/support arrangement, method for producing the arrangement, and use of the arrangement in the processing of the wafer
    Patent number: 11193208
    Abstract: A wafer/support arrangement, including a wafer, a support system, which includes a support and an elastomer layer, and a connecting layer, wherein the connecting layer is a sol-gel layer. The invention further relates to a coated wafer for a wafer/support arrangement according to the invention, wherein a sol-gel layer is used as a connecting layer for a corresponding wafer/support assembly, and to a method for processing the back side of a wafer.
    Type: Grant
    Filed: September 22, 2015
    Date of Patent: December 7, 2021
    Assignee: NISSAN CHEMICAL INDUSTRIES, LTD.
    Inventor: Phillipp Lorenz
  • WAFER/SUPPORT ARRANGEMENT, METHOD FOR PRODUCING THE ARRANGEMENT, AND USE OF THE ARRANGEMENT IN THE PROCESSING OF THE WAFER
    Publication number: 20170298506
    Abstract: A wafer/support arrangement, including a wafer, a support system, which includes a support and an elastomer layer, and a connecting layer, wherein the connecting layer is a sol-gel layer. The invention further relates to a coated wafer for a wafer/support arrangement according to the invention, wherein a sol-gel layer is used as a connecting layer for a corresponding wafer/support assembly, and to a method for processing the back side of a wafer.
    Type: Application
    Filed: September 22, 2015
    Publication date: October 19, 2017
    Applicant: NISSAN CHEMICAL INDUSTRIES, LTD.
    Inventor: Phillipp LORENZ