Patents by Inventor Philp T. Klemarczyk

Philp T. Klemarczyk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7012120
    Abstract: This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.
    Type: Grant
    Filed: March 27, 2001
    Date of Patent: March 14, 2006
    Assignee: Henkel Corporation
    Inventors: Philp T. Klemarczyk, Andrew D. Messana, Afranio Torres-Filho, Erin K. Yaeger, Takahisa Doba
  • Patent number: 6958368
    Abstract: The present invention relates to new cure accelerators for anaerobic curable compositions. These anaerobic cure accelerators are generally sulfinimides and oxygen and sulfur derivatives thereof, sulfonimides and oxygen and sulfur derivatives thereof, sulfonamides and oxygen and sulfur derivatives thereof, and oxygen and sulfur analogues of sulfimides.
    Type: Grant
    Filed: May 31, 2002
    Date of Patent: October 25, 2005
    Assignee: Henkel Corporation
    Inventors: Philp T. Klemarczyk, Karen R. Brantl, Andrew D. Messana
  • Patent number: 6894082
    Abstract: This invention relates to latent foamable compositions for use in or as adhesives, sealants and/or coatings. The compositions include a curable component or a thermoplastic component, together with a latent foaming agent. In curable versions of the inventive compositions, a cure initiator or catalyst may also be included.
    Type: Grant
    Filed: September 16, 2002
    Date of Patent: May 17, 2005
    Assignee: Henkel Corporation
    Inventors: Karen R. Brantl, Philp T. Klemarczyk
  • Publication number: 20040063800
    Abstract: This invention relates to latent foamable compositions for use in or as adhesives, sealants and/or coatings. The compositions include a curable component or a thermoplastic component, together with a latent foaming agent. In curable versions of the inventive compositions, a cure initiator or catalyst may also be included.
    Type: Application
    Filed: September 16, 2002
    Publication date: April 1, 2004
    Applicant: HENKEL LOCTITE CORPORATION
    Inventors: Karen R. Brantl, Philp T. Klemarczyk