Patents by Inventor Phisanu Sombatklung

Phisanu Sombatklung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for semiconductor testing at low temperature
    Patent number: 9385053
    Abstract: A method for testing a plurality of semiconductor devices arranged on a strip may include forming an array of semiconductor devices on a frame, wherein contact pads of adjacent semiconductor devices are shorted, partially cutting the strip to electrically isolate individual semiconductor devices in the array, placing the strip on an adhesive tape configured to withstand low temperatures (e.g., below ?20° C. or below ?50° C.), arranging the strip and tape on a test chuck, exposing the test chuck, strip, and tape to temperatures below an ambient temperature and testing the plurality of semiconductor devices while exposed to a low temperature. In one embodiment a KAPTON™ film is used as the adhesive tape.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: July 5, 2016
    Assignee: MICROCHIP TECHNOLOGY INCORPORATED
    Inventors: Santi Butsoongnoen, Yutthana Jittabut, Phisanu Sombatklung, Manuschai Manuschai, Prasit Prasit
  • Method And Apparatus For Semiconductor Testing At Low Temperature
    Publication number: 20160118308
    Abstract: A method for testing a plurality of semiconductor devices arranged on a strip may include forming an array of semiconductor devices on a frame, wherein contact pads of adjacent semiconductor devices are shorted, partially cutting the strip to electrically isolate individual semiconductor devices in the array, placing the strip on an adhesive tape configured to withstand low temperatures (e.g., below ?20° C. or below ?50° C.), arranging the strip and tape on a test chuck, exposing the test chuck, strip, and tape to temperatures below an ambient temperature and testing the plurality of semiconductor devices while exposed to a low temperature. In one embodiment a KAPTON™ film is used as the adhesive tape.
    Type: Application
    Filed: December 28, 2015
    Publication date: April 28, 2016
    Applicant: Microchip Technology Incorporated
    Inventors: Santi Butsoongnoen, Yutthana Jittabut, Phisanu Sombatklung, Manuschai Manuschai, Prasit Prasit
  • Method and apparatus for semiconductor testing at low temperature
    Patent number: 9224659
    Abstract: A method for testing a plurality of semiconductor devices arranged on a strip may include forming an array of semiconductor devices on a frame, wherein contact pads of adjacent semiconductor devices are shorted, partially cutting the strip to electrically isolate individual semiconductor devices in the array, placing the strip on an adhesive tape configured to withstand low temperatures (e.g., below ?20° C. or below ?50° C.), arranging the strip and tape on a test chuck, exposing the test chuck, strip, and tape to temperatures below an ambient temperature and testing the plurality of semiconductor devices while exposed to a low temperature. In one embodiment a KAPTON™ film is used as the adhesive tape.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: December 29, 2015
    Assignee: MICROCHIP TECHNOLOGY INCORPORATED
    Inventors: Santi Butsoongnoen, Yutthana Jittabut, Phisanu Sombatklung, Manuschai Chainok, Prasit Sriprasert
  • Method and Apparatus for Semiconductor Testing at Low Temperature
    Publication number: 20140273307
    Abstract: A method for testing a plurality of semiconductor devices arranged on a strip may include forming an array of semiconductor devices on a frame, wherein contact pads of adjacent semiconductor devices are shorted, partially cutting the strip to electrically isolate individual semiconductor devices in the array, placing the strip on an adhesive tape configured to withstand low temperatures (e.g., below ?20° C. or below ?50° C.), arranging the strip and tape on a test chuck, exposing the test chuck, strip, and tape to temperatures below an ambient temperature and testing the plurality of semiconductor devices while exposed to a low temperature. In one embodiment a KAPTON™ film is used as the adhesive tape.
    Type: Application
    Filed: March 11, 2014
    Publication date: September 18, 2014
    Inventors: Santi Butsoongnoen, Yutthana Jittabut, Phisanu Sombatklung, Manuschai Chainok, Prasit Sriprasert