Patents by Inventor Phon Quan Lee

Phon Quan Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070290023
    Abstract: A tool for coating a heat-conducting medium on penetrating holes of heat-dissipating fins mainly includes a hollow pipe body. One end of the pipe body has an annular recessed portion. The upper and lower ends of the recessed portion are formed respectively with an annular guiding slope. Further, on the recessed portion, a plurality of outlet holes is distributed in a circumferential manner. A plurality of supporting pillars is formed between adjacent outlet holes. When the tool penetrates into the penetrating holes of the heat-dissipating fins, a user may apply an external force to the other end of the pipe body, so as to cause the heat-conducting medium within the pipe body to overflow via the outlet holes. The overflowing heat-conducting medium fills the annular recessed portion first.
    Type: Application
    Filed: May 15, 2007
    Publication date: December 20, 2007
    Inventor: Phon-Quan LEE
  • Publication number: 20070287324
    Abstract: A water block includes a first casing, a solder paste, and a second casing. The first casing has a solder reserve area formed on an outer edge thereof. The solder paste is coated on the solder reserve area. The second casing is jointed with the first casing via the solder past to form a channel space. The present invention uses tin solder as a soldering material, so that the soldering temperature is between 200° C. and 400° C. Hence, the present invention avoids oxygenation and weakened bond strength due to high temperatures. Therefore, when the solder paste melts, the flux separates from the tin solder and bubbles of the tin solder are removed from the solder reserve area at a soldering temperature of between 200˜400° C. Moreover, the bond strength of the joint surface between two casings is increased, so cooling liquids won't easily leak out from the strong joint surface.
    Type: Application
    Filed: June 5, 2007
    Publication date: December 13, 2007
    Inventors: Phon-Quan Lee, Chia-Chun Cheng
  • Patent number: 7267167
    Abstract: A method for manufacturing a heat sink has steps of providing multiple fins and a heat pipe, assembling the fins, mounting a thermal-conductive medium, attaching the heat pipe, heating the thermal-conductive medium, rotating the fins and cooling the thermal-conductive medium. Because the thermal-conductive medium is inserted in the cavities in the fins before the heat pipe extends through the fins, inserting the thermal-conductive medium is easy and convenient.
    Type: Grant
    Filed: July 25, 2006
    Date of Patent: September 11, 2007
    Assignee: Cooler Master Co., Ltd
    Inventor: Phon Quan Lee