Abstract: Data comprising a request specifying a desired change in electrical load for a defined period of time is received. The electrical load is associated with a plurality of resources under control of resource agents and on a utility grid. Available capacity of resources within the control of each resource agent over the defined period of time is determined. Each available capacity is determined at least using a resource load model. Using the determined available capacity of resources over the defined period of time, resource scheduling instructions are calculated for a subset of resources. The resource scheduling instructions satisfy the desired change in electrical load of the request. Data characterizing the resource scheduling instructions is provided. Related systems, apparatus, methods, and articles are also described.

Abstract: The subject matter described herein relates to the organized measurement, dispatch and/or control of disparate and distributed resources along the length of and at the ends of the electrical grid. Related systems, apparatus, methods, and articles are also described.

Abstract: Data comprising a request specifying a desired change in electrical load for a defined period of time is received. The electrical load is associated with a plurality of resources under control of resource agents and on a utility grid. Available capacity of resources within the control of each resource agent over the defined period of time is determined. Each available capacity is determined at least using a resource load model. Using the determined available capacity of resources over the defined period of time, resource scheduling instructions are calculated for a subset of resources. The resource scheduling instructions satisfy the desired change in electrical load of the request. Data characterizing the resource scheduling instructions is provided. Related systems, apparatus, methods, and articles are also described.

Abstract: Data comprising a request specifying a desired change in electrical load for a defined period of time is received. The electrical load is associated with a plurality of resources under control of resource agents and on a utility grid. Available capacity of resources within the control of each resource agent over the defined period of time is determined. Each available capacity is determined at least using a resource load model. Using the determined available capacity of resources over the defined period of time, resource scheduling instructions are calculated for a subset of resources. The resource scheduling instructions satisfy the desired change in electrical load of the request. Data characterizing the resource scheduling instructions is provided. Related systems, apparatus, methods, and articles are also described.

Abstract: Data comprising a request specifying a desired change in electrical load for a defined period of time is received. The electrical load is associated with a plurality of resources under control of resource agents and on a utility grid. Available capacity of resources within the control of each resource agent over the defined period of time is determined. Each available capacity is determined at least using a resource load model. Using the determined available capacity of resources over the defined period of time, resource scheduling instructions are calculated for a subset of resources. The resource scheduling instructions satisfy the desired change in electrical load of the request. Data characterizing the resource scheduling instructions is provided. Related systems, apparatus, methods, and articles are also described.

Abstract: A layered test pattern for measuring registration and critical dimension (CD) for multi-layer semiconductor integrated circuits is disclosed. A first layer includes a first pattern having vertical and horizontal portions. A second layer is formed over the first layer and includes a second pattern having vertical and horizontal portions having nominal vertical and horizontal phase shifts with respect to the vertical and horizontal portions, respectively, of the first pattern. The vertical and horizontal portions include periodically repeating vertical lines and horizontal lines, respectively. The nominal phase shifts may be half of the period of the vertical and horizontal lines. A scatterometry tool measures the width of the lines and the phase shift of the first pattern relative to the second pattern. The width of the lines corresponds to CD, whereas the difference between the measured phase shift and the nominal phase shift indicates variation in registration.

Abstract: A layered test pattern for measuring registration and critical dimension (CD) for multi-layer semiconductor integrated circuits is disclosed. A first layer includes a first pattern having vertical and horizontal portions. A second layer is formed over the first layer and includes a second pattern having vertical and horizontal portions having nominal vertical and horizontal phase shifts with respect to the vertical and horizontal portions, respectively, of the first pattern. The vertical and horizontal portions include periodically repeating vertical lines and horizontal lines, respectively. The nominal phase shifts may be half of the period of the vertical and horizontal lines. A scatterometry tool measures the width of the lines and the phase shift of the first pattern relative to the second pattern. The width of the lines corresponds to CD, whereas the difference between the measured phase shift and the nominal phase shift indicates variation in registration.

Abstract: A method and file structure for exposing images from a plurality of reticles onto a wafer. Multiple images are effectively merged into the same file, which means the wafer need not be unloaded from a stage while exposing multiple reticles. For example, every odd numbered column can contain images from one reticle, and every even numbered column can contain images from a second reticle, where image shifts are used to align the patterns exactly. A continuous pattern is utilized to mimic normal wafer processing.

Abstract: A mask for exposing a first layer and a second layer on a process substrate, where the first and second layers are two separate layers of an integrated circuit. The mask includes a mask substrate that is substantially completely transmissive to a first wavelength of light and a second wavelength of light. A layer of a first material is disposed on the mask substrate, where the first material is substantially opaque to the first wavelength of light. The layer of the first material is patterned for the first layer. A layer of a second material is disposed on the mask substrate, where the second material is substantially opaque to the second wavelength of light. The layer of the second material is patterned for the second layer, where the first layer and the second layer are aligned on the mask substrate.