Patents by Inventor Phoung A. Nguyen

Phoung A. Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140140213
    Abstract: A method performed by a network system communicatively coupled to a device over a wireless access network, the method comprising transmitting a traffic flow to, or receiving the traffic flow from, a software application on the device, the traffic flow comprising one or more related data transfers over the wireless access network, the traffic flow being routed between the software application and the network system through an assisting element comprising a control application or a proxy agent on the device, wherein the traffic flow has a characteristic associating the traffic flow with the first software application, the characteristic preserving the association between the traffic flow and the software application when the traffic flow is routed by the one or more assisting elements; identifying the characteristic; and implementing at least a portion of a control, accounting, or notification service policy based on the identified characteristic.
    Type: Application
    Filed: December 5, 2013
    Publication date: May 22, 2014
    Applicant: Headwater Partners I LLC
    Inventors: Gregory G. Raleigh, Jeffrey Green, James Lavine, Vien-Phoung Nguyen
  • Patent number: 6407566
    Abstract: A test module for simultaneously testing a plurality of IC packages in a simulated multi-chip module environment. The test module includes a module board adapted to receive the IC packages and a plurality of module adapters configured to secure the IC packages to the module board. The module adapters secure the IC packages to the module board and establish electrical contact between the IC package leads and a plurality of contact pads disposed on the module board, with no permanent bonding agent. Reliable electrical connections are established between the IC package leads and the contact pads by a plurality of protruding pins extending from each module adapter, which bias the IC package leads towards the contact pads. A plurality of IC packages assembled into the test module may be subjected to module level testing.
    Type: Grant
    Filed: April 6, 2000
    Date of Patent: June 18, 2002
    Assignee: Micron Technology, Inc.
    Inventors: Steven J. Brunelle, Phoung A. Nguyen
  • Patent number: D466497
    Type: Grant
    Filed: September 12, 2000
    Date of Patent: December 3, 2002
    Assignee: Motorola, Inc.
    Inventors: Harold Levern Wikel, Huy Phoung Nguyen