Abstract: Polymeric compositions which contain a thermoplastic aromatic polyester, preferably polybutylene terephthalate, and a polyester block copolymer having a recrystallization temperature greater than 150.degree. C., preferably a thermoplastic elastomer containing aromatic polyester blocks and aliphatic polyester blocks. The ratio of the block copolymer to the aromatic polyester is 0.05:1 to 0.35:1, preferably 0.15:1 to 0.30:1. These compositions are particularly useful as the insulation on hermetic lead wires for use in refrigerant systems. To prevent cracking of such insulation when it is contacted by a varnish used to provide hermetic sealing, it can be covered by a thin layer of a fluoropolymer.

Abstract: This invention relates to multi-component assemblies comprising a plurality of substantially parallel insulated conductors and or cables at least one of which is wrapped in a flexible affixment means thereby enabling the wrapped component to be secured to a support substrate.

Abstract: This invention relates to flat cables comprising a plurality of substantially parallel insulated conductors bonded to a polymeric substrate which has a melting point greater than 200.degree. C. and/or a thickness less than 2.5 mils (98 microns) and a method for the production of such cables.

Abstract: This invention relates to flat cables comprising a plurality of insulated conductors bonded to a porous substrate. The porous substrate is impregnated with a polymeric material capable of bonding to the insulation of the conductors. The strength of the bond can be varied by varying the amount of the impregnant. If it is desired to separate one or more of the conductors from the substrate, for example to form a branch off, a minimum amount of impregnant can be used.

Abstract: This invention relates to flat cables comprising a plurality of insulated conductors bonded to a metallic substrate. The metallic substrate is provided with a layer of polymeric material capable of bonding to the insulation of the conductors. The layer of polymeric material is bonded to the metallic substrate with a peel strength of at least about 1 pound per linear inch (pli). The insulated conductors are bonded to the layer of polymeric material. The bond strength between the insulated conductors and the layer of polymeric material and the bond strength between the layer of polymeric material and the metallic substrate are such that the individual insulated conductors can be cleanly peeled away from the substrate.