Patents by Inventor Phuc Dinh

Phuc Dinh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11493917
    Abstract: Methods, devices and systems for remotely operating a machine using a communication device. In one aspect, a method includes generating images showing at least one operating range of the machine by using at least one camera of the machine, transmitting the generated images and an image of an operating surface of the machine to the communication device via a radio network, displaying at least one of: the operating surface image and at least one of the generated images on an operating display of the communication device, accepting machine operation commands input by an operator using the operating display, and then transmitting the machine operation commands via the radio network, thereby remotely operating the machine.
    Type: Grant
    Filed: October 14, 2014
    Date of Patent: November 8, 2022
    Assignee: TRUMPF Werkzeugmaschinen GmbH + Co. KG
    Inventors: Klaus Bauer, Christian Goerg, Vinh Phuc Dinh
  • Patent number: 10445165
    Abstract: Examples associated with inactive application restarting are described. One example method includes establishing a connection between a host device and a remote device. The connection is used for communications between the host device and an application on the remote device. An inactive state of the application is detected on the remote device. A message is transmitted to the remote device to notify a user to restart the application. A user interaction with the message restarts the application.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: October 15, 2019
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chee Keat Fong, Phuc Dinh
  • Publication number: 20190056986
    Abstract: Examples associated with inactive application restarting are described. One example method includes establishing a connection between a host device and a remote device. The connection is used for communications between the host device and an application on the remote device. An inactive state of the application is detected on the remote device. A message is transmitted to the remote device to notify a user to restart the application. A user interaction with the message restarts the application.
    Type: Application
    Filed: August 21, 2017
    Publication date: February 21, 2019
    Inventors: Chee Keat Fong, Phuc Dinh
  • Publication number: 20150103180
    Abstract: Methods, devices and systems for remotely operating a machine using a communication device. In one aspect, a method includes generating images showing at least one operating range of the machine by using at least one camera of the machine, transmitting the generated images and an image of an operating surface of the machine to the communication device via a radio network, displaying at least one of: the operating surface image and at least one of the generated images on an operating display of the communication device, accepting machine operation commands input by an operator using the operating display, and then transmitting the machine operation commands via the radio network, thereby remotely operating the machine.
    Type: Application
    Filed: October 14, 2014
    Publication date: April 16, 2015
    Inventors: Klaus Bauer, Christian Goerg, Vinh Phuc Dinh
  • Patent number: 6344684
    Abstract: A multi-layered pin grid array interposer used in a test socket for testing and converting a package having a non-pin grid array footprint to a pin grid array footprint. The multi-layered pin grid array interposer test socket includes a multi-layered pin grid array interposer, a semiconductor device mounted on a package having a non-grid array footprint and a fastener. The multi-layered pin grid array interposer includes a top signal layer having bonding pads on an upper surface, a bottom signal layer having a pin grid array footprint on a bottom surface, at least one power layer between ground layers, the ground layers being between the top signal layer and bottom signal layer, and a links for connecting the plurality of bonding pads to the pins of the pin grid array footprint. The fastener presses the package against the multi-layered pin grid array interposer connecting the leads of the package with the bonding pads.
    Type: Grant
    Filed: July 6, 2000
    Date of Patent: February 5, 2002
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Rafiqul Hussain, Phuc Dinh Do, Benjamin G. Tubera