Abstract: A system for abating dangerous substances, for example, from a semiconductor fabrication process tool, comprises a thermal oxidation unit configured to accept a waste gas stream, a particulate remover directly coupled to the thermal oxidation unit, a universal sump chassis directly coupled to the particulate remover, a packed column directly coupled to the universal sump chassis, and a dry scrub canister coupled to the packed column. An embodiment includes multiple parallel components, that is, two or more thermal oxidation units, each configured to accept a different waste gas stream which may be combustible when mixed, two or more particulate removers and two or more packed columns, each directly coupled to the universal sump chassis. A method comprises, first, oxidizing combustible substances; second, removing particulate-phase and water-soluble gas-phase components; third, absorbing acid gases; and last, adsorbing residual contaminants.

Abstract: A translator circuit (21) converts an ECL logic level to a TTL logic level. The translator circuit (21) operates at high speeds, rejects power supply noise, and does not use Schottky diodes for preventing transistors from saturating. The translator circuit comprises a differential input stage (22), a level shift stage (23), a differential stage (24), and an output stage (25). The differential input stage (22) is responsive to an ECL signal and provides a differential output signal. The level shift stage (23) level shifts the differential output signal of the differential input stage a predetermined DC voltage. The differential stage (24) is responsive to the level shift stage (23) and generates first and second output signals. The differential stage (24) rejects power supply noise coupled from the level shift stage (23).