Patents by Inventor Phui Phoong Chuang

Phui Phoong Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame support plate and window clamp for wire bonding machines
    Patent number: 9070762
    Abstract: A lead frame support plate 200 and a window clamp 400 for wire bonding machines are disclosed herein. In a described embodiment, the lead frame support plate 200 includes a network of suction grooves 218 provided on a support surface 212, each suction groove 218 being arranged to be in fluid communication with at least a vacuum hole 216 to enable a suction force to be created, in response to a vacuum force, along the network of suction grooves for holding a lead frame against the support surface. A window clamp 400 having slots for compensating deformation of the window clamp and a method of fabricating the lead frame support plate are also disclosed.
    Type: Grant
    Filed: April 7, 2014
    Date of Patent: June 30, 2015
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Phui Phoong Chuang, Hasrul Bin Hasim, Wan Azmi, Siti Nurulhaida Bt. Ramlan, Ka Shing Kwan, Ting Yu He, Jun Wan
  • LEAD FRAME SUPPORT PLATE AND WINDOW CLAMP FOR WIRE BONDING MACHINES
    Publication number: 20140217152
    Abstract: A lead frame support plate 200 and a window clamp 400 for wire bonding machines are disclosed herein. In a described embodiment, the lead frame support plate 200 includes a network of suction grooves 218 provided on a support surface 212, each suction groove 218 being arranged to be in fluid communication with at least a vacuum hole 216 to enable a suction force to be created, in response to a vacuum force, along the network of suction grooves for holding a lead frame against the support surface. A window clamp 400 having slots for compensating deformation of the window clamp and a method of fabricating the lead frame support plate are also disclosed.
    Type: Application
    Filed: April 7, 2014
    Publication date: August 7, 2014
    Inventors: Phui Phoong CHUANG, Hasrul Bin HASIM, Wan AZMI, Siti Nurulhaida Bt. RAMLAN, Ka Shing KWAN, Ting Yu HE, Jun WAN
  • Lead frame support plate and window clamp for wire bonding machines
    Patent number: 8752751
    Abstract: A lead frame support plate 200 and a window clamp 400 for wire bonding machines are disclosed herein. In a described embodiment, the lead frame support plate 200 includes a network of suction grooves 218 provided on a support surface 212, each suction groove 218 being arranged to be in fluid communication with at least a vacuum hole 216 to enable a suction force to be created, in response to a vacuum force, along the network of suction grooves for holding a lead frame against the support surface. A window clamp 400 having slots for compensating deformation of the window clamp and a method of fabricating the lead frame support plate are also disclosed.
    Type: Grant
    Filed: July 13, 2012
    Date of Patent: June 17, 2014
    Assignee: ASM Technology Singapore Pte Ltd
    Inventors: Phui Phoong Chuang, Hasrul Bin Hasim, Wan Azmi, Siti Nurulhaida Bt. Ramlan, Ka Shing Kwan, Ting Yu He, Jun Wan
  • LEAD FRAME SUPPORT PLATE AND WINDOW CLAMP FOR WIRE BONDING MACHINES
    Publication number: 20140014708
    Abstract: A lead frame support plate 200 and a window clamp 400 for wire bonding machines are disclosed herein. In a described embodiment, the lead frame support plate 200 includes a network of suction grooves 218 provided on a support surface 212, each suction groove 218 being arranged to be in fluid communication with at least a vacuum hole 216 to enable a suction force to be created, in response to a vacuum force, along the network of suction grooves for holding a lead frame against the support surface. A window clamp 400 having slots for compensating deformation of the window clamp and a method of fabricating the lead frame support plate are also disclosed.
    Type: Application
    Filed: July 13, 2012
    Publication date: January 16, 2014
    Inventors: Phui Phoong CHUANG, Hasrul Bin HASIM, Wan AZMI, Siti Nurulhaida Bt. RAMLAN, Ka Shing KWAN, Ting Yu HE, Jun WAN
  • Lead-frame for semiconductor devices
    Patent number: 7075172
    Abstract: A lead-frame for semiconductor devices having a mold with at least one air vent for the resin to seep out of during its injecting into the mold, the air vent being positioned between the upper and lower surface of the frame, wherein the frame provides a through hole positioned at the outlet of the air vent so that, when the resin has solidified, it forms a flash which is in coherence with the surface of the frame.
    Type: Grant
    Filed: July 26, 2001
    Date of Patent: July 11, 2006
    Assignees: STMicroelectronics S.r.l., STMicroelectronics SDN, BHD
    Inventors: Andrea Giovanni Cigada, Phui Phoong Chuang
  • Lead-frame for semiconductor devices
    Publication number: 20020033523
    Abstract: A lead-frame for semiconductor devices having a mold with at least one air vent for the resin to seep out of during its injecting into the mold, the air vent being positioned between the upper and lower surface of the frame, wherein the frame provides a through hole positioned at the outlet of the air vent so that, when the resin has solidified, it forms a flash which is in coherence with the surface of the frame.
    Type: Application
    Filed: July 26, 2001
    Publication date: March 21, 2002
    Applicant: STMicroelectronics S.r.l.
    Inventors: Andrea Giovanni Cigada, Phui Phoong Chuang