Abstract: A packaging process of an electronic device includes the following steps. Firstly, in step (a), an upper shielding casing, a lower shielding casing and a printed circuit board are provided, wherein the printed circuit board is mounted thereon an input device and an output device. Then, in step (b), the printed circuit board is placed within a closed space defined between the upper shielding casing and the lower shielding casing. Afterward, in step (c), the upper shielding casing and the lower shielding casing are encapsulated with an encapsulation layer and portions of the input device and output device are exposed.

Abstract: An assembling structure of an electronic apparatus and the assembling method thereof are disclosed. The assembling structure of an electronic apparatus comprises a casing having a receiving space, a plurality of conductive terminals, a printed circuit board and at least an electronic element. The plurality of conductive terminals are disposed on the casing, and each conductive terminal has a first part extending to the outer side of the casing and a second part extending to the inner side of the casing, wherein the second part has a through hole. The printed circuit board is disposed in the receiving space and has at least a conductive element and a plurality of conductive pads, wherein the plurality of conductive pads contact the second parts of the plurality of conductive terminals.

Abstract: An assembling structure of an electronic apparatus and the assembling method thereof are disclosed. The assembling structure of an electronic apparatus comprises a casing having a receiving space, a plurality of conductive terminals, a printed circuit board and at least an electronic element. The plurality of conductive terminals are disposed on the casing, and each conductive terminal has a first part extending to the outer side of the casing and a second part extending to the inner side of the casing, wherein the second part has a through hole. The printed circuit board is disposed in the receiving space and has at least a conductive element and a plurality of conductive pads, wherein the plurality of conductive pads contact the second parts of the plurality of conductive terminals.