Patents by Inventor Pi-Chi Chang

Pi-Chi Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Carrier for high frequency signals having conducting wires with roughness portions and a carrier layout method
    Patent number: 8198962
    Abstract: A carrier for transmitting a high frequency signal and a carrier layout method thereof are provided. The carrier includes a substrate, conducting wires and reference planes both formed on the substrate. The carrier layout method includes defining impedance and thickness of the carrier according to the high frequency signal and defining layout parameters according to the impedance and the thickness. The layout parameters include a conducting layer formed on the conducting wires, a coplanar waveguide encompasses both the reference planes and the conducting wires as a part thereof, roughness portions formed on the conducting wires, recessed portions formed on the conducting wires, and the substrate being a high loss tangent substrate. The layout is performed according to the layout parameters defined thereabove, so as to increase loss of the high frequency signal in transmission.
    Type: Grant
    Filed: August 11, 2009
    Date of Patent: June 12, 2012
    Assignee: Askey Computer Corp.
    Inventors: Chih-Ming Yang, Chien-Hao Huang, Chao-Nan Tsai, Ching-Feng Hsieh, Chin-Ching Chang, Chun-Hsiung Tsai, Pi-Chi Chang, Chih-Wei Huang
  • CARRIER FOR TRANSMITTING HIGH FREQUENCY SIGNAL AND CARRIER LAYOUT METHOD THEREOF
    Publication number: 20100156572
    Abstract: A carrier for transmitting a high frequency signal and a carrier layout method thereof are provided. The carrier includes a substrate, conducting wires and reference planes both formed on the substrate. The carrier layout method includes defining impedance and thickness of the carrier according to the high frequency signal and defining layout parameters according to the impedance and the thickness. The layout parameters include a conducting layer formed on the conducting wires, a coplanar waveguide formed between the reference planes and the conducting wires, roughness portions formed on the conducting wires, recessed portions formed on the conducting wires, and the substrate being a high loss tangent substrate. The layout is performed according to the layout parameters defined thereabove, so as to increase loss of the high frequency signal in transmission.
    Type: Application
    Filed: August 11, 2009
    Publication date: June 24, 2010
    Applicant: ASKEY COMPUTER CORP.
    Inventors: Chih-Ming Yang, Chien-Hao Huang, Chao-Nan Tsai, Ching-Feng Hsieh, Chin-Ching Chang, Chun-Hsiung Tsai, Pi-Chi Chang, Chih-Wei Huang