Patents by Inventor Pi-Chun Chang

Pi-Chun Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240115616
    Abstract: The present disclosure provides a method for treating liver cirrhosis by using a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors. The composition of the present disclosure achieves the effect of treating liver cirrhosis through various efficacy experiments.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 11, 2024
    Inventors: Po-Cheng Lin, Pi-Chun Huang, Zih-Han Hong, Ming-Hsi Chuang, Yi-Chun Lin, Chia-Hsin Lee, Chun-Hung Chen, Chao-Liang Chang, Kai-Ling Zhang
  • Publication number: 20080023533
    Abstract: A packing box comprising four top boards and a case body is provided. Two top boards respectively have a slot and a gripping board. Another two top boards respectively have a plugging board and a slit. The case body has an opening and four upper edges that are sequentially connected to the four top boards. The two top boards that respectively have the slot and the gripping board are firstly folded to cover the opening. Next, the other two top boards are folded for being disposed upon the original two top boards. Then, the gripping boards can pass through the slits and are protruded above the top boards. Afterwards, the plugging boards can be inserted into the slots for fixing the handle.
    Type: Application
    Filed: July 10, 2007
    Publication date: January 31, 2008
    Applicant: BENQ CORPORATION
    Inventor: Pi-Chun Chang
  • Patent number: 7306102
    Abstract: A shock-absorbing package structure comprising a frame and a shock-absorbing rib is provided. The frame forms an inner space to accommodate a component. The shock-absorbing rib extending from the frame toward the inner space has two cuts for folding the shock-absorbing rib to adjust the dimension of the inner space according to the shape of the component.
    Type: Grant
    Filed: March 9, 2005
    Date of Patent: December 11, 2007
    Assignee: BENQ Corporation
    Inventor: Pi-Chun Chang
  • Publication number: 20050199528
    Abstract: A shock-absorbing package structure comprising a frame and a shock-absorbing rib is provided. The frame forms an inner space to accommodate a component. The shock-absorbing rib extending from the frame toward the inner space has two cuts for folding the shock-absorbing rib to adjust the dimension of the inner space according to the shape of the component.
    Type: Application
    Filed: March 9, 2005
    Publication date: September 15, 2005
    Inventor: Pi-Chun Chang
  • Patent number: 5667072
    Abstract: This invention relates to the design of a packaging set for packing an electric device and its accessories. The packaging set comprises a rectangular cushion block for packing and protecting the electric device, a rectangular carton tightly packed outside the cushion block for protecting the cushion block, one packing slot installed in the cushion block for packing accessories of the electric device and an L-shaped side cover for sealing the slot opening of the packing slot. The side cover can be repeatedly closed and opened for accessing the accessories without damaging the packaging set.
    Type: Grant
    Filed: April 26, 1996
    Date of Patent: September 16, 1997
    Assignee: Acer Peripherals, Inc.
    Inventor: Pi-Chun Chang