Patents by Inventor Pi-Hsia WANG

Pi-Hsia WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR STRUCTURE FOR DIE CRACK DETECTION
    Publication number: 20230019796
    Abstract: A III-V semiconductor die for die crack detection is provided. The III-V semiconductor die includes a device area. The III-V semiconductor die further includes a doped semiconductor ring region. The doped semiconductor ring region surrounds the device area. At least one active device or at least one passive device is formed in the device area of the III-V semiconductor die.
    Type: Application
    Filed: June 1, 2022
    Publication date: January 19, 2023
    Inventors: Chu-Lung HUANG, Pi-Hsia WANG