Patents by Inventor Pi Hsieh

Pi Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060289332
    Abstract: A package assembly includes a base plate having multiple first connecting blocks each having a first wall and two first inserts respectively formed on two opposed sides of the first connecting block and two U-shaped connecting blocks oppositely formed on two opposed sides of the base plate, a top plate foldably connected to a side of the base plate and having multiple second connecting blocks, a cutout and a channel to accommodate the second connecting blocks when the top plate is folded relative to the base plate and two shoulder plates respectively and foldably formed on two opposed sides of the base plate to sandwiched the side having the top plate.
    Type: Application
    Filed: June 28, 2005
    Publication date: December 28, 2006
    Inventors: Pi Hsieh, Chia-Hao Chang
  • Patent number: 6968954
    Abstract: A packing device made of thermo-formed plastic sheet includes a bottom plate having adjacent first recesses and each first recess has first flaps which are higher than a receiving plane of the first recess, and each first recess has a positioning portion in an inside thereof. A side plate being foldable along a folding line relative to the bottom plate has engaging portions which are engaged with the positioning portions. The side plate includes adjacent second recesses and each second recess has a plurality of second flaps which are higher than a receiving plane of the second recess. The side plate has receiving portions located opposite to the engaging portions. A top plate being foldable along a folding line relative to the side plate has protrusions which are engaged with the receiving portions when the top plate is folded the folding line toward the side plate. The top plate has third recesses and each of which has third flaps which are higher than a receiving plane of the third recess.
    Type: Grant
    Filed: October 7, 2003
    Date of Patent: November 29, 2005
    Assignee: Wan Jeou Pyng Plastics Industry Co., Ltd.
    Inventor: Pi Hsieh
  • Publication number: 20050074585
    Abstract: A packing device made of thermo-formed plastic sheet includes a bottom plate having adjacent first recesses and each first recess has first flaps which are higher than a receiving plane of the first recess, and each first recess has a positioning portion in an inside thereof. A side plate being foldable along a folding line relative to the bottom plate has engaging portions which are engaged with the positioning portions. The side plate includes adjacent second recesses and each second recess has a plurality of second flaps which are higher than a receiving plane of the second recess. The side plate has receiving portions located opposite to the engaging portions. A top plate being foldable along a folding line relative to the side plate has protrusions which are engaged with the receiving portions when the top plate is folded the folding line toward the side plate. The top plate has third recesses and each of which has third flaps which are higher than a receiving plane of the third recess.
    Type: Application
    Filed: October 7, 2003
    Publication date: April 7, 2005
    Inventor: Pi Hsieh
  • Patent number: D864569
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: October 29, 2019
    Inventor: Pi Hsieh
  • Patent number: D906814
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: January 5, 2021
    Inventor: Pi Hsieh