Patents by Inventor Pi-Huang Lee

Pi-Huang Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mechanisms for resistivity measurement of bump structures
    Patent number: 8742776
    Abstract: The embodiments described above provide mechanisms for bump resistivity measurement. By using designated bumps on one or more corners of dies, the resistivity of bumps may be measured without damaging devices and without a customized probing card. In addition, bump resistivity may be collected across the entire wafer. The collected resistivity data may be used to monitor the stability and/or health of processes used to form bumps and their underlying layers.
    Type: Grant
    Filed: January 25, 2011
    Date of Patent: June 3, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: You-Hua Chou, Mill-Jer Wang, Pi-Huang Lee, Jeff Wang, Feynmann Chu
  • Universal array type probe card design for semiconductor device testing
    Patent number: 8248091
    Abstract: A universal system for testing different semiconductor devices provides a probe head with a probe pattern that may be used to test different test patterns formed on different semiconductor devices. Each of a plurality of bumps or pads of the test pattern contacts a corresponding probe of the probe head to enable the semiconductor device to be tested. The universal probe head may additionally or alternatively include a substrate design on the probe head that provides a pattern on the substrate of the probe head that may be used in conjunction with different patterns formed on a plurality of different printed circuit boards for testing different semiconductor devices.
    Type: Grant
    Filed: October 20, 2006
    Date of Patent: August 21, 2012
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hsu Ming Cheng, Yung-Liang Kuo, Pi-Huang Lee, Ann Luh, Frank Hwang, Wen-Hung Wu
  • MECHANISMS FOR RESISTIVITY MEASUREMENT OF BUMP STRUCTURES
    Publication number: 20120133379
    Abstract: The embodiments described above provide mechanisms for bump resistivity measurement. By using designated bumps on one or more corners of dies, the resistivity of bumps may be measured without damaging devices and without a customized probing card. In addition, bump resistivity may be collected across the entire wafer. The collected resistivity data may be used to monitor the stability and/or health of processes used to form bumps and their underlying layers.
    Type: Application
    Filed: January 25, 2011
    Publication date: May 31, 2012
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: You-Hua CHOU, Mill-Jer WANG, Pi-Huang LEE, Jeff WANG, Feynmann CHU
  • UNIVERSAL ARRAY TYPE PROBE CARD DESIGN FOR SEMICONDUCTOR DEVICE TESTING
    Publication number: 20080094093
    Abstract: A universal system for testing different semiconductor devices provides a probe head with a probe pattern that may be used to test different test patterns formed on different semiconductor devices. Each of a plurality of bumps or pads of the test pattern contacts a corresponding probe of the probe head to enable the semiconductor device to be tested. The universal probe head may additionally or alternatively include a substrate design on the probe head that provides a pattern on the substrate of the probe head that may be used in conjunction with different patterns formed on a plurality of different printed circuit boards for testing different semiconductor devices.
    Type: Application
    Filed: October 20, 2006
    Publication date: April 24, 2008
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ming-Cheng Hsu, Y. L. Kuo, Pi-Huang Lee, Ann Luh, Frank Hwang, Wen-Hung Wu