Patents by Inventor Pi-Min Kao

Pi-Min Kao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9860433
    Abstract: An image building module includes an image builder, a signal-shielding flexible film, and a signal shielding cover. The image builder includes a first image capturing element and a processing chip. The first image capturing element is used for capturing a first image. The processing chip is used for processing the first image. The signal-shielding flexible film covers the processing chip. The signal shielding cover covers the image builder and the signal-shielding flexible film. The signal shielding cover has a first through hole exposing the first image capturing element.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: January 2, 2018
    Assignee: PEGATRON CORPORATION
    Inventors: Tsung-Chih Yeh, Tung-Liang Wang, Pi-Min Kao, Hsun-Hsin Lee, Chun-Hao Kuo
  • Publication number: 20160191769
    Abstract: An image building module includes an image builder, a signal-shielding flexible film, and a signal shielding cover. The image builder includes a first image capturing element and a processing chip. The first image capturing element is used for capturing a first image. The processing chip is used for processing the first image. The signal-shielding flexible film covers the processing chip. The signal shielding cover covers the image builder and the signal-shielding flexible film. The signal shielding cover has a first through hole exposing the first image capturing element.
    Type: Application
    Filed: December 2, 2015
    Publication date: June 30, 2016
    Inventors: Tsung-Chih YEH, Tung-Liang WANG, Pi-Min KAO, Hsun-Hsin LEE, Chun-Hao KUO
  • Patent number: 7359189
    Abstract: An electronic device has a removable module installed inside. The removable module includes a first surface and a second surface. The first surface is adjacent to the second surface. At least one first fastener is disposed on the first surface. At least one second fastener is disposed on the second surface. A printed circuit board and at least one track are installed in the housing. At least one rail has at least one third fastener and fourth fastener. The third fastener is inserted into the first fastener. The fourth fastener is inserted into the second fastener. The rail is disposed between the track and the removable module.
    Type: Grant
    Filed: March 16, 2007
    Date of Patent: April 15, 2008
    Assignee: Asustek Computer Inc.
    Inventors: Lin-Hsu Chiang, Shih-Kun Chou, Pi-Min Kao
  • Publication number: 20070223189
    Abstract: An electronic device has a removable module installed inside. The removable module includes a first surface and a second surface. The first surface is adjacent to the second surface. At least one first fastener is disposed on the first surface. At least one second fastener is disposed on the second surface. A printed circuit board and at least one track are installed in the housing. At least one rail has at least one third fastener and fourth fastener. The third fastener is inserted into the first fastener. The fourth fastener is inserted into the second fastener. The rail is disposed between the track and the removable module.
    Type: Application
    Filed: March 16, 2007
    Publication date: September 27, 2007
    Applicant: ASUSTeK Computer Inc.
    Inventors: Lin-Hsu Chiang, Shih-Kun Chou, Pi-Min Kao