Patents by Inventor Pi-Yeh CHIA

Pi-Yeh CHIA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10825684
    Abstract: Provided is a material composition and method for that includes providing a substrate and forming a resist layer over the substrate. In various embodiments, the resist layer includes a multi-metal complex including an extreme ultraviolet (EUV) absorption element and a bridging element. By way of example, the EUV absorption element includes a first metal type and the bridging element includes a second metal type. In some embodiments, an exposure process is performed to the resist layer. After performing the exposure process, the exposed resist layer is developed to form a patterned resist layer.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: November 3, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shu-Hao Chang, Chien-Chih Chen, Kuo-Chang Kau, Jeng-Horng Chen, Pi-Yeh Chia, Chi-Ren Chen, Ying-Chih Lin
  • Publication number: 20170271150
    Abstract: Provided is a material composition and method for that includes providing a substrate and forming a resist layer over the substrate. In various embodiments, the resist layer includes a multi-metal complex including an extreme ultraviolet (EUV) absorption element and a bridging element. By way of example, the EUV absorption element includes a first metal type and the bridging element includes a second metal type. In some embodiments, an exposure process is performed to the resist layer. After performing the exposure process, the exposed resist layer is developed to form a patterned resist layer.
    Type: Application
    Filed: January 6, 2017
    Publication date: September 21, 2017
    Inventors: Shu-Hao CHANG, Chien-Chih CHEN, Kuo-Chang KAU, Jeng-Horng CHEN, Pi-Yeh CHIA, Chi-Ren CHEN, Ying-Chih LIN