Patents by Inventor Pia Buckel

Pia Buckel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8480846
    Abstract: Fumed silicon dioxide powder in the form of aggregated primary particles having a BET surface area of 175±15 m2/g and a thickening effect, based on the BET surface area, of greater than 18 mPas g/m2 is hydrophobicized with polydimethylsiloxane. This hydrophobic fumed silica has a BET surface area of 110±25 m2/g. It can be used in epoxy resins. These epoxy resins in turn can be used as adhesives.
    Type: Grant
    Filed: February 10, 2009
    Date of Patent: July 9, 2013
    Assignee: Evonik Degussa GmbH
    Inventors: Juergen Meyer, Mario Scholz, Pia Buckel, Andreas Hille
  • Publication number: 20120251707
    Abstract: The invention provides an adhesive comprising structurally modified, pyrogenically prepared silicas containing on their surface organosilane groups of the formula (I) SiCnH(2n+1), where n is 2 to 18. The invention further provides for the use of these structurally modified, pyrogenically prepared silicas in adhesives.
    Type: Application
    Filed: April 30, 2012
    Publication date: October 4, 2012
    Applicant: EVONIK DEGUSSA GMBH
    Inventors: Mario SCHOLZ, Juergen Meyer, Horst Zeizinger, Pia Buckel
  • Patent number: 8173737
    Abstract: Adhesive, comprising silanized, structurally modified, pyrogenically prepared silicas containing on their surface fixed vinyl groups or vinylsilyl groups, with hydrophobic groups, such as trimethylsilyl and/or dimethylsilyl and/or monomethylsilyl, additionally being fixed on the surface.
    Type: Grant
    Filed: May 6, 2008
    Date of Patent: May 8, 2012
    Assignee: Evonik Degussa GmbH
    Inventors: Mario Scholz, Juergen Meyer, Juergen Heym, Pia Buckel
  • Patent number: 8022130
    Abstract: Adhesive and sealant systems based on epoxy resins, polyurethane, silane-terminated polymers, silicones, unsaturated polyester resins, vinyl ester resins, acrylates, polyvinyl acetate, polyvinyl alcohol, polyvinyl ether, ethylene vinyl acetate, ethylene-acrylic acid copolymers, polyvinyl acetates, polystyrene, polyvinyl chloride, styrene-butadiene rubber, chloroprene rubber, nitrile rubber, butyl rubber, polysulfide, polyethylene, polypropylene, fluorinated hydrocarbons, polyamides, saturated polyesters and copolyesters, phenol-formaldehyde resins, cresol-/resorcinol-formaldehyde resins, urea-formaldehyde resins, melamine-formaldehyde resins, polyimides, polybenzimidazoles, polysulfones, which contain 1 wt. % to 15 wt. % of a compacted, hydrophobic pyrogenic silica.
    Type: Grant
    Filed: November 17, 2004
    Date of Patent: September 20, 2011
    Assignee: Evonik Degussa GmbH
    Inventors: Rüdiger Nowak, Werner Michel, Pia Buckel
  • Publication number: 20100305236
    Abstract: The invention provides an adhesive comprising structurally modified, pyrogenically prepared silicas containing on their surface organosilane groups of the formula (I) SiCnH(2n+1), where n is 2 to 18. The invention further provides for the use of these structurally modified, pyrogenically prepared silicas in adhesives.
    Type: Application
    Filed: May 6, 2008
    Publication date: December 2, 2010
    Applicant: EVONIK DEGUSSA GMBH
    Inventors: Mario Scholz, Juergen Meyer, Horst Zeizinger, Pia Buckel
  • Publication number: 20100286311
    Abstract: Fumed silicon dioxide powder in the form of aggregated primary particles having a BET surface area of 175±15 m2/g and a thickening effect, based on the BET surface area, of greater than 18 mPas g/m2 is hydrophobicized with polydimethylsiloxane. This hydrophobic fumed silica has a BET surface area of 110±25 m2/g. It can be used in epoxy resins. These epoxy resins in turn can be used as adhesives.
    Type: Application
    Filed: February 10, 2009
    Publication date: November 11, 2010
    Applicant: EVONIK DEGUSSA GmbH
    Inventors: Juergen Meyer, Mario Scholz, Pia Buckel, Andreas Hille
  • Publication number: 20100137485
    Abstract: Adhesive, comprising silanized, structurally modified, pyrogenically prepared silicas containing on their surface fixed vinyl groups or vinylsilyl groups, with hydrophobic groups, such as trimethylsilyl and/or dimethylsilyl and/or monomethylsilyl, additionally being fixed on the surface.
    Type: Application
    Filed: May 6, 2008
    Publication date: June 3, 2010
    Applicant: EVONIK DEGUSSA GmbH
    Inventors: Mario Scholz, Juergen Meyer, Juergen Heym, Pia Buckel
  • Publication number: 20070129480
    Abstract: Adhesive and sealant systems based on epoxy resins, polyurethane, silane-terminated polymers, silicones, unsaturated polyester resins, vinyl ester resins, acrylates, polyvinyl acetate, polyvinyl alcohol, polyvinyl ether, ethylene vinyl acetate, ethylene-acrylic acid copolymers, polyvinyl acetates, polystyrene, polyvinyl chloride, styrene-butadiene rubber, chloroprene rubber, nitrile rubber, butyl rubber, polysulfide, polyethylene, polypropylene, fluorinated hydrocarbons, polyamides, saturated polyesters and copolyesters, phenol-formaldehyde resins, cresol-/resorcinol-formaldehyde resins, urea-formaldehyde resins, melamine-formaldehyde resins, polyimides, polybenzimidazoles, polysulfones, which contain 1 wt. % to 15 wt. % of a compacted, hydrophobic pyrogenic silica.
    Type: Application
    Filed: November 17, 2004
    Publication date: June 7, 2007
    Inventors: Rudiger Nowak, Werner Michel, Pia Buckel