Patents by Inventor Pia Frei

Pia Frei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9012529
    Abstract: A hot-melt formulation useful as a wound dressing comprises a chemically crosslinked polymer matrix obtainable from prepolymers crosslinkable by means of photopolymerization. Hydrocolloids are embedded in the chemically crosslinked polymer, matrix. The formulation is obtainable by combining the prepolymers and hydrocolloids, and heating and processing the mixture through a slot die, wherein the mixture has a viscosity of less than 100 Pa*s and a processing temperature of less than 150° C. The prepolymers are crosslinked by means of photopolymerization by irradiation with UV light.
    Type: Grant
    Filed: June 22, 2005
    Date of Patent: April 21, 2015
    Assignee: Nolax AG
    Inventors: Pia Frei, Andreas Dobmann, Judith Nyffeler
  • Publication number: 20080051485
    Abstract: The invention relates to a hot-melt composition, especially for using as an absorbent medical or cosmetic article, preferably as a wound dressing, and containing (a) a chemically cross-linked polymer matrix, and (b) hydrocolloids which are embedded in the chemically cross-linked polymer matrix. The inventive composition can be obtained by processing a melt in a hot melt method, said melt having a melting viscosity of less than 100 Pa*s, preferably less than 75 Pa*s, and especially preferably less than 50 Pa*s, at a processing temperature of less than 150° C., preferably less than 140° C., and especially preferably less than 130° C.
    Type: Application
    Filed: June 22, 2005
    Publication date: February 28, 2008
    Applicant: COLLANO AG
    Inventors: Pia Frei, Andreas Dobmann, Judith Nyffeler
  • Patent number: 7268178
    Abstract: A hot-melt pressure-sensitive adhesive composition which, as a result of the use of a hydrogenated styrene-butadiene-butylene-styrene block copolymer, has improved properties in respect of immediate adhesion and also the removal of the hot-melt pressure-sensitive adhesive composition from a carrier substrate without leaving a residue, is described.
    Type: Grant
    Filed: December 28, 2005
    Date of Patent: September 11, 2007
    Assignee: Henkel Kommanditgesellschaft auf Aktien
    Inventor: Pia Frei
  • Publication number: 20070054088
    Abstract: The inventive composition contains at least one polyacrylate that can be melted and cross-linked using UV light, optional additives and is characterised by an oligomer compound comprising at least one functional group that can be cross-linked using UV, said compound having a viscosity of between 0.1 and 20 Pa·s at 25° C. The invention also relates to the use of the composition as a UV cross-linked hot-melt adhesive and to a method for producing a substrate that is provided with the composition. The composition can be used at a lower temperature than previous conventional hot-melt adhesives.
    Type: Application
    Filed: March 1, 2004
    Publication date: March 8, 2007
    Applicant: Collano AG
    Inventors: Christelle Matijasic, Pia Frei, Andreas Dobmann
  • Publication number: 20060211808
    Abstract: The invention relates to an adhesive composition containing (a) an elastomer block copolymer having a diblock portion greater than 40%, preferably greater than 55%, more preferably greater than 70%, (b) a sulphonated, especially branched copolyester and (c) optionally, additional additives, such as tackifiers and/or softeners and/or stabilisers. The inventive adhesive compositions have advantages, particularly, based on high wet-peel strength.
    Type: Application
    Filed: May 8, 2004
    Publication date: September 21, 2006
    Inventors: Pia Frei, Andreas Dobmann
  • Publication number: 20060155023
    Abstract: A hot-melt pressure-sensitive adhesive composition which, as a result of the use of a hydrogenated styrene-butadiene-butylene-styrene block copolymer, has improved properties in respect of immediate adhesion and also the removal of the hot-melt pressure-sensitive adhesive composition from a carrier substrate without leaving a residue, is described.
    Type: Application
    Filed: December 28, 2005
    Publication date: July 13, 2006
    Inventor: Pia Frei