Patents by Inventor Piebe Zijstra

Piebe Zijstra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fuse structure having reduced heat dissipation towards the substrate
    Patent number: 7537969
    Abstract: A fuse structure (100) suitable for incorporation in an integrated circuit presents a reduced thermal conduction footprint to the substrate (103). A patterned material stack (102) is formed on a substrate (103) and at least a portion of a material disposed between the substrate (103) and an upper portion of the fuse structure (100) is selectively etched so as to reduce the thermal conduction pathway between the upper portion and the substrate (103). In a further aspect of the present invention, the reduced cross-section of the fuse structure (100) has an increased current density resulting in a lower amount of current being needed to program the fuse.
    Type: Grant
    Filed: September 18, 2004
    Date of Patent: May 26, 2009
    Assignee: NXP B.V.
    Inventors: Piebe Zijstra, Ann Killian