Abstract: Molding composition comprising from 10 to 50 wt.% of the polycondensation product of an alkylene glycol or a mixture of the latter with up to 20 wt.% of 2,2'-bis(4-hydroxycyclohexyl)propane or a halogenated derivative thereof, with an ethylenically unsaturated dicarboxylic acid and a saturated dicaboxylic acid, having a melting point of at least 60.degree. C, an acid value of less than 50 and a Gardner viscosity from Y to Z.sub.3, from 0.2 to 2 wt.% of organic peroxide with a decomposition temperature above 70.degree. C, and an inert filler. The resulting molded articles are particularly useful in the electrical and electronic fields.

Abstract: Molding composition comprising an inert filler, from 0.2 to 2 wt.% of an organic peroxide with a decomposition temperature above 70.degree. C, from 0.5 to 10 wt.% of an amide of an unsaturated aliphatic carboxylic acid, and from 10 to 50 wt.% of unsaturated polyester A and/or unsaturated polyester B, wherein said polyester A is the polycondensation product of 2,2'-bis(4-hydroxycyclohexyl)propane or a halogenated derivative thereof with an unsaturated dicarboxylic acid, and said polyester B is the polycondensation product of an alkylene glycol with an unsaturated dicarboxylic acid and a saturated dicarboxylic acid.The resulting molded articles are particularly useful in the electrical and electronic fields.

Abstract: Molding composition comprising from 10 to 50 wt.% of the polycondensation product of 2,2'-bis(4-hydroxycyclohexyl) propane or a halogenated derivative thereof, and maleic or fumaric acid, having a melting point above 70.degree. C, an acid value of less than 50 and a Gardener viscosity from Y to Z.sub.3, from 0.2 to 2 wt.% of an organic peroxide which decomposes at a temperature above 70.degree. C, and an inert filler.The resulting molded articles are particularly useful in the electrical and electronic fields.