Patents by Inventor Pierpaolo Lupo
Pierpaolo Lupo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12028982Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.Type: GrantFiled: October 3, 2023Date of Patent: July 2, 2024Assignee: Apple Inc.Inventors: Bilal Mohamed Ibrahim Kani, Benjamin J. Grena, Kyusang Kim, David M. Kindlon, Pierpaolo Lupo, Kishore N. Renjan, Manoj Vadeentavida
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Publication number: 20240074066Abstract: Various embodiments of a mold cavity structure of a transfer molding system are disclosed. The transfer molding system includes a first mold-forming structure and a second mold-forming structure. The second mold-forming structure includes a mold cavity. The mold cavity includes a gate region, a component region, and a vent region. The component region is configured to enclose an electrical component. A volume of the vent region is adjustable. The transfer molding system further includes an inlet port coupled to the gate region and configured to direct a flow of a molding compound into the mold cavity during an operation of the transfer molding system.Type: ApplicationFiled: May 5, 2023Publication date: February 29, 2024Applicant: Apple Inc.Inventors: Nitesh KUMBHAT, Yanfeng Chen, Mandar S. Painaik, Shankar S. Pennathur, Pierpaolo Lupo
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Publication number: 20240032203Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.Type: ApplicationFiled: October 3, 2023Publication date: January 25, 2024Inventors: Bilal Mohamed Ibrahim Kani, Benjamin J. Grena, Kyusang Kim, David M. Kindlon, Pierpaolo Lupo, Kishore N. Renjan, Manoj Vadeentavida
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Patent number: 11864322Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.Type: GrantFiled: February 3, 2023Date of Patent: January 2, 2024Assignee: Apple Inc.Inventors: Bilal Mohamed Ibrahim Kani, Benjamin J. Grena, Kyusang Kim, David M. Kindlon, Pierpaolo Lupo, Kishore N. Renjan, Manoj Vadeentavida
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Publication number: 20230386865Abstract: Optical packages and methods of fabrication are described. In an embodiment, a controller chip is embedded along with optical components, including a photodetector (PD) and one or more emitters, in a single package.Type: ApplicationFiled: May 12, 2023Publication date: November 30, 2023Inventors: Kishore N. Renjan, Bilal Mohamed Ibrahim Kani, Kyusang Kim, Manoj Vadeentavida, Pierpaolo Lupo, Prashanth S. Holenarsipur, Praveesh Chandran, Vinodh Babu, Yuta Kuboyama
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Patent number: 11817383Abstract: Temperature sensor packages and methods of fabrication are described. The temperature sensor packages in accordance with embodiments may be rigid or flexible. In some embodiments the temperature sensor packages are configured for touch sensing, and include an electrically conductive sensor pattern such as a thermocouple or resistance temperature detector (RTD) pattern. In some embodiments, the temperature sensor packages are configured for non-contact sensing an include an embedded transducer.Type: GrantFiled: March 3, 2022Date of Patent: November 14, 2023Assignee: Apple Inc.Inventors: Pierpaolo Lupo, Bilal Mohamed Ibrahim Kani, Kishore N. Renjan, Kyusang Kim, Manoj Vadeentavida
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Publication number: 20230189445Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.Type: ApplicationFiled: February 3, 2023Publication date: June 15, 2023Inventors: Bilal Mohamed Ibrahim Kani, Benjamin J. Grena, Kyusang Kim, David M. Kindlon, Pierpaolo Lupo, Kishore N. Renjan, Manoj Vadeentavida
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Patent number: 11651976Abstract: Optical packages and methods of fabrication are described. In an embodiment, a controller chip is embedded along with optical components, including a photodetector (PD) and one or more emitters, in a single package.Type: GrantFiled: June 24, 2020Date of Patent: May 16, 2023Assignee: Apple Inc.Inventors: Kishore N. Renjan, Bilal Mohamed Ibrahim Kani, Kyusang Kim, Manoj Vadeentavida, Pierpaolo Lupo, Prashanth S. Holenarsipur, Praveesh Chandran, Vinodh Babu, Yuta Kuboyama
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Patent number: 11576262Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.Type: GrantFiled: March 25, 2021Date of Patent: February 7, 2023Assignee: Apple Inc.Inventors: Bilal Mohamed Ibrahim Kani, Benjamin J. Grena, Kyusang Kim, David M. Kindlon, Pierpaolo Lupo, Kishore N. Renjan, Manoj Vadeentavida
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Patent number: 11552053Abstract: Optical sensor modules and methods of fabrication are described. In an embodiment, an optical component is mounted on a module substrate. In an embodiment, a pillar of stacked wireballs adjacent the optical component is used for vertical connection between the module substrate and a top electrode pad of the optical component.Type: GrantFiled: June 25, 2020Date of Patent: January 10, 2023Assignee: Apple Inc.Inventors: Bilal Mohamed Ibrahim Kani, Kishore N. Renjan, Kyusang Kim, Manoj Vadeentavida, Pierpaolo Lupo, Praveesh Chandran
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Publication number: 20220270955Abstract: Temperature sensor packages and methods of fabrication are described. The temperature sensor packages in accordance with embodiments may be rigid or flexible. In some embodiments the temperature sensor packages are configured for touch sensing, and include an electrically conductive sensor pattern such as a thermocouple or resistance temperature detector (RTD) pattern. In some embodiments, the temperature sensor packages are configured for non-contact sensing an include an embedded transducer.Type: ApplicationFiled: March 3, 2022Publication date: August 25, 2022Inventors: Pierpaolo Lupo, Bilal Mohamed Ibrahim Kani, Kishore N. Renjan, Kyusang Kim, Manoj Vadeentavida
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Patent number: 11313741Abstract: Temperature sensor packages and methods of fabrication are described. The temperature sensor packages in accordance with embodiments may be rigid or flexible. In some embodiments the temperature sensor packages are configured for touch sensing, and include an electrically conductive sensor pattern such as a thermocouple or resistance temperature detector (RTD) pattern. In some embodiments, the temperature sensor packages are configured for non-contact sensing an include an embedded transducer.Type: GrantFiled: December 11, 2019Date of Patent: April 26, 2022Assignee: Apple Inc.Inventors: Pierpaolo Lupo, Bilal Mohamed Ibrahim Kani, Kishore N. Renjan, Kyusang Kim, Manoj Vadeentavida
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Publication number: 20210405313Abstract: Optical sensor modules and methods of fabrication are described. In an embodiment, an optical component is mounted on a module substrate. In an embodiment, a pillar of stacked wireballs adjacent the optical component is used for vertical connection between the module substrate and a top electrode pad of the optical component.Type: ApplicationFiled: June 25, 2020Publication date: December 30, 2021Applicant: Apple Inc.Inventors: Bilal Mohamed Ibrahim Kani, Kishore N. Renjan, Kyusang Kim, Manoj Vadeentavida, Pierpaolo Lupo, Praveesh Chandran
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Publication number: 20210337671Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.Type: ApplicationFiled: March 25, 2021Publication date: October 28, 2021Inventors: Bilal Mohamed Ibrahim Kani, Benjamin J. Grena, Kyusang Kim, David M. Kindlon, Pierpaolo Lupo, Kishore N. Renjan, Manoj Vadeentavida
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Publication number: 20210181039Abstract: Temperature sensor packages and methods of fabrication are described. The temperature sensor packages in accordance with embodiments may be rigid or flexible. In some embodiments the temperature sensor packages are configured for touch sensing, and include an electrically conductive sensor pattern such as a thermocouple or resistance temperature detector (RTD) pattern. In some embodiments, the temperature sensor packages are configured for non-contact sensing an include an embedded transducer.Type: ApplicationFiled: December 11, 2019Publication date: June 17, 2021Inventors: Pierpaolo Lupo, Bilal Mohamed Ibrahim Kani, Kishore N. Renjan, Kyusang Kim, Manoj Vadeentavida
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Publication number: 20210090908Abstract: Optical packages and methods of fabrication are described. In an embodiment, a controller chip is embedded along with optical components, including a photodetector (PD) and one or more emitters, in a single package.Type: ApplicationFiled: June 24, 2020Publication date: March 25, 2021Inventors: Kishore N. Renjan, Bilal Mohamed Ibrahim Kani, Kyusang Kim, Manoj Vadeentavida, Pierpaolo Lupo, Prashanth S. Holenarsipur, Praveesh Chandran, Vinodh Babu, Yuta Kuboyama