Abstract: In various embodiments, an illumination apparatus features spatially separated input and output regions, a light source, a phosphor for light conversion, and an out-coupling structure.

Abstract: In various embodiments, an illumination apparatus features spatially separated input and output regions, a light source, a phosphor for light conversion, and an out-coupling structure.

Abstract: In various embodiments, an illumination apparatus features spatially separated input and output regions, a light source, a phosphor for light conversion, and an out-coupling structure.

Abstract: In various embodiments, an illumination apparatus features spatially separated input and output regions, a light source, a phosphor for light conversion, and an out-coupling structure.

Abstract: An opto-mechanical coupler and corresponding method of manufacture are provided. The coupler may include a body defining a bottom surface, a receiving surface, and a reflective surface. The reflective surface may redirect optical signals between a first direction and a second direction. The receiving surface may position one or more optical fibers along the second direction such that an optical signal from the plurality of optoelectronic transceivers may be directed into the one or more optical fibers or an optical signal received from the one or more optical fibers may be directed into the plurality of the optoelectronic transceivers. The receiving surface may also define grooves to locate each optical fiber at a height relative to a first optical path in the second direction.

Abstract: Networking systems and methods of assembly are described that provide a modular system that includes a main networking box and a detachable module. The main networking box and the detachable module are configured to be connected to each other on a datacenter rack via board-to-board connectors to provide the desired connections to the network, but can also be unlocked and detached from each other, such as to allow the main networking box to be replaced. In this way, the main networking box can be replaced in the field to provide a repair, or the detachable module can be replaced to provide a different connection type, without requiring the other component and/or its connections to be disturbed.

Abstract: Methods and associated apparatuses are described that provide an optical waveguide structure configured for use within an optoelectronic connector. The optical waveguide structure includes a base member having a first surface defining a plurality of trenches including an optical transmission medium and one or more channels including an adhesive material. The optical waveguide structure includes a lid member having a first surface, where the first surface of the lid member is disposed against the first surface of the base member to form the optical waveguide structure. The one or more channels having the adhesive material serve to secure the lid member to the base member, and the plurality of trenches having an optical transmission medium allow optical signals to pass therethrough.

Abstract: A twin axial cable structure is provided for transmitting signals that makes use of insulative materials that are not easily extruded, such as expanded polyethylene (ePE) and expanded polytetrafluoroethylene (ePTFE). The cable structure includes an insulative body portion having a pair of open channels defined through an outer longitudinal surface of the insulative body portion, in which are disposed a pair of conductive wires. A conductive sheet is disposed on the insulative body portion, and a grounding element is placed in contact with the conductive sheet, such as by applying planar conductive sheets and grounding elements and/or ground wires to the insulative body portion. Corresponding methods and apparatuses for manufacturing the same are also provided. The cable structures, methods, and apparatuses described herein can produce a cable structure for transmitting multiple differential signals within the same structure, with minimal negative effects on other, neighboring transmissions.

Abstract: Methods and associated apparatuses are described that provide an optical waveguide structure configured for use within an optoelectronic connector. The optical waveguide structure includes a base member having a first surface defining a plurality of trenches including an optical transmission medium and one or more channels including an adhesive material. The optical waveguide structure includes a lid member having a first surface, where the first surface of the lid member is disposed against the first surface of the base member to form the optical waveguide structure. The one or more channels having the adhesive material serve to secure the lid member to the base member, and the plurality of trenches having an optical transmission medium allow optical signals to pass therethrough.

Abstract: Networking systems and methods of assembly are described that provide a modular system that includes a main networking box and a detachable module. The main networking box and the detachable module are configured to be connected to each other on a datacenter rack via board-to-board connectors to provide the desired connections to the network, but can also be unlocked and detached from each other, such as to allow the main networking box to be replaced. In this way, the main networking box can be replaced in the field to provide a repair, or the detachable module can be replaced to provide a different connection type, without requiring the other component and/or its connections to be disturbed.

Abstract: An apparatus and method of assembly are described that provide an improved printed circuit board (PCB) assembly for an electro-optical interface, where more accurate positioning and alignment of electro-optical components can be achieved in an active part of the PCB assembly that is used for the electro-optical interface to meet tighter tolerances in an easier and more cost efficient manner. In particular, a photonic integrated circuit (PIC) is received in a cavity defined in a PCB that includes conductive elements for transmitting electrical signals. An optoelectronic transducer is connected to the PIC to convert between the optical signals and the corresponding electrical signals, and an optical coupler is secured to the optoelectronic transducer and supported by the PIC and/or PCB, where the optical coupler is configured to transmit the optical signals between the optoelectronic transducer and an optical fiber.

Abstract: In various embodiments, an illumination apparatus features spatially separated input and output regions, a light source, a phosphor for light conversion, and an out-coupling structure.

Abstract: Apparatuses, systems, and methods of assembly are described that provide mechanisms for integrating an optical module (e.g., an MBOM) into a main switch system to allow the optical module to be replaced without having to replace other components of the main switch system. The field replaceable modular optical interconnect unit includes a housing, a printed circuit board assembly supported within the housing, an optical module supported on the printed circuit board assembly that converts between optical signals and electrical signals for transmitting or receiving optical signals through a fiber optic cable, a board-to-board connector on a rear panel of the housing that enables electrical signals to be transmitted between the printed circuit board assembly and a main switch system box, and an external connector on a front panel of the housing that can engage an external optical fiber for transmitting optical signals between the optical module and an external component.

Abstract: In various embodiments, an illumination apparatus features spatially separated input and output regions, a light source, a phosphor for light conversion, and an out-coupling structure.

Abstract: An opto-mechanical coupler and corresponding method of manufacture are provided. The coupler may include a body defining a bottom surface, a receiving surface, and a reflective surface. The reflective surface may redirect optical signals between a first direction and a second direction. The receiving surface may position one or more optical fibers along the second direction such that an optical signal from the plurality of optoelectronic transceivers may be directed into the one or more optical fibers or an optical signal received from the one or more optical fibers may be directed into the plurality of the optoelectronic transceivers. The receiving surface may also define grooves to locate each optical fiber at a height relative to a first optical path in the second direction.

Abstract: Apparatuses, systems, and methods of assembly are described that provide mechanisms for integrating an optical module (e.g., an MBOM) into a main switch system to allow the optical module to be replaced without having to replace other components of the main switch system. The field replaceable modular optical interconnect unit includes a housing, a printed circuit board assembly supported within the housing, an optical module supported on the printed circuit board assembly that converts between optical signals and electrical signals for transmitting or receiving optical signals through a fiber optic cable, a board-to-board connector on a rear panel of the housing that enables electrical signals to be transmitted between the printed circuit board assembly and a main switch system box, and an external connector on a front panel of the housing that can engage an external optical fiber for transmitting optical signals between the optical module and an external component.

Abstract: An apparatus and method of assembly are described that provide an improved printed circuit board (PCB) assembly for an electro-optical interface, where more accurate positioning and alignment of electro-optical components can be achieved in an active part of the PCB assembly that is used for the electro-optical interface to meet tighter tolerances in an easier and more cost efficient manner. In particular, a photonic integrated circuit (PIC) is received in a cavity defined in a PCB that includes conductive elements for transmitting electrical signals. An optoelectronic transducer is connected to the PIC to convert between the optical signals and the corresponding electrical signals, and an optical coupler is secured to the optoelectronic transducer and supported by the PIC and/or PCB, where the optical coupler is configured to transmit the optical signals between the optoelectronic transducer and an optical fiber.

Abstract: In various embodiments, an illumination apparatus features spatially separated input and output regions, a light source, a phosphor for light conversion, and an out-coupling structure.