Patents by Inventor Pierre Coat

Pierre Coat has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210129506
    Abstract: A phosphorescent thermoplastic composite layered structure has at least one layered element. Each one of the at least one layered element has a polymer matrix and a reinforcing fiber combined with the polymer matrix. The polymer matrix includes a thermoplastic resin and a phosphorescent compound. The phosphorescent compound is dispersed in the thermoplastic resin and has multiple particles uniformly distributed inside the thermoplastic resin. The reinforcing fiber is combined with the polymer matrix of the at least one layered element by pressing and heating to form the phosphorescent thermoplastic composite layered structure.
    Type: Application
    Filed: November 4, 2019
    Publication date: May 6, 2021
    Applicant: Corex Materials Corporation
    Inventors: Ying-Jan HO, PIERRE COAT, Shao-Chen CHIU
  • Publication number: 20190345333
    Abstract: A polymer blend containing polycarbonate and polysulfone in accordance with an embodiment of the present invention is provided, including a polysulfone resin, a polycarbonate resin, and a solvent for dissolving the polysulfone resin and the polycarbonate resin. The blending ratio of the polycarbonate resin to the polysulfone resin in the polymer blend ranges from 1:3 to 3:1. By adjusting the blending ratios of the polycarbonate resin to the polysulfone resin, the group of the polycarbonate resin and the group of the polysulfone resin are stably compatible with each other, and the glass transition temperature of the polymer blend is also remarkably increased, such that the a high-temperature resistance and improved mechanical properties are achieved.
    Type: Application
    Filed: May 14, 2018
    Publication date: November 14, 2019
    Inventors: Pierre Coat, Shao-Chen Chiu
  • Publication number: 20190194404
    Abstract: The present disclosure describes a composite material that includes a polysulfone aromatic polymer combined with an adhesion promoter, and a reinforcing fiber. The polysulfone aromatic polymer may be a polysulfone aromatic polymer, a polyethersulfone aromatic polymer, or a polyphenylsulfone aromatic polymer. The adhesion promoter may be, for example, a polyamideimide or a polyamide-amic acid polymer. The disclosure also describes a method of making a composite material using a solvent-dissolved polysulfone aromatic polymer and a reinforcing fiber.
    Type: Application
    Filed: March 11, 2014
    Publication date: June 27, 2019
    Applicant: AONIX ADVANCED MATERIALS CORP.
    Inventors: Jerome LE CORVEC, Pierre COAT, David LIEVIN
  • Publication number: 20160115300
    Abstract: The present disclosure provides a composite material that includes a thermoplastic poly(phenylene) polymer and a re-enforcement component. The poly(phenylene) polymer includes para-phenylene units. At least a portion of the para-phenylene units may be substituted with a polar non-acid functional group. The thermoplastic poly(phenylene) polymer may also include meta-phenylene units. The disclosure also describes a method of making a composite material using a solvent-dissolved poly(phenylene) polymer and a reinforcing fiber.
    Type: Application
    Filed: March 11, 2014
    Publication date: April 28, 2016
    Applicant: AONIX ADVANCED MATERIALS CORP.
    Inventors: Jerome LE CORVEC, Pierre COAT, David LIEVIN
  • Publication number: 20040109652
    Abstract: An optical fiber telecommunication cable including a sheath and at least one optical fiber is provided. The sheath encloses at least one optical fiber, and a hydrogen absorbing composition is disposed between the sheath and the at least one optical fiber. The hydrogen absorbing composition includes an oil, a thixotropic agent, an oxidant system and a carbon nanostructure component, wherein the carbon nanostructure component is hydrogen absorbent.
    Type: Application
    Filed: December 4, 2002
    Publication date: June 10, 2004
    Applicant: ALCATEL
    Inventors: Brian Risch, Pierre Coat, Swati Neogi