Abstract: A method is provided that includes (1) receiving information about a substrate processed within a barrier/seed layer deposition subsystem from an integrated inspection system of the subsystem; (2) determining an electroplating process to perform within an electroplating subsystem based at least in part on the information received from the inspection system of the barrier/seed layer deposition subsystem; (3) directing the electroplating subsystem to deposit a fill layer on the substrate based on the electroplating process; (4) receiving information about the fill layer from an integrated inspection system of the electroplating subsystem; (5) determining a planarization process to perform within a planarization subsystem based at least in part on the information received from the inspection system of the electroplating subsystem; and (6) directing the planarization subsystem to planarize the substrate based on the planarization process.