Abstract: A stator element of a progressive cavity pump having a reinforcement tube having a longitudinal axis, an inner face (22), and an outer face, and an elastomer liner fixed to the inner face of the reinforcement tube, wherein a portion of the reinforcement tube has a substantially constant thickness (e) and in that said portion of the reinforcement tube is deformed such that it comprises at least a first relief pattern and a second relief pattern, the first relief pattern having the shape of a helical strip that is right-handed relative to the longitudinal axis, the second relief pattern having the shape of a helical strip that is left-handed relative to the longitudinal axis, the first and second relief patterns meeting in at least one section.

Abstract: Stator element of a progressive cavity pump and progressive cavity pump The invention relates to a stator element of a progressive cavity pump. The stator element comprises: a reinforcement tube (20) having a longitudinal axis (A-A), an inner face (22), and an outer face (24), and an elastomer liner fixed to the inner face of the reinforcement tube, characterized in that at least a portion of the reinforcement tube (20) has a substantially constant thickness (e) and in that said portion of the reinforcement tube (20) is deformed such that it comprises at least a first relief pattern (28) and a second relief pattern (30), the first relief pattern (28) having the shape of a helical strip that is right-handed relative to the longitudinal axis (A-A), the second relief pattern (30) having the shape of a helical strip that is left-handed relative to the longitudinal axis (A-A), the first and second relief patterns meeting in at least one section (32).

Abstract: A method and system for management of a vacuum pump connected to a braking system of a motor vehicle, and use of an electronic control unit connected to the vacuum pump. At least one differential pressure threshold associated with the vacuum pump, selected from a first differential pressure threshold controlling stopping of operation of the vacuum pump, a second differential pressure threshold controlling starting of the vacuum pump, and a third differential pressure threshold, lower than the second threshold and signalling alerts representative of operating faults, is determined by taking into account a first set of data representative of the detection or otherwise of a repetitive braking situation and/or a second set of data representative of altitude of the vehicle.

Abstract: A method and system for management of a vacuum pump connected to a braking system of a motor vehicle, and use of an electronic control unit connected to the vacuum pump. At least one differential pressure threshold associated with the vacuum pump, selected from a first differential pressure threshold controlling stopping of operation of the vacuum pump, a second differential pressure threshold controlling starting of the vacuum pump, and a third differential pressure threshold, lower than the second threshold and signalling alerts representative of operating faults, is determined by taking into account a first set of data representative of the detection or otherwise of a repetitive braking situation and/or a second set of data representative of altitude of the vehicle.

Abstract: A process, system, and kit for evaluating the relief of the skin using a substrate with an adhesive surface. The process includes the steps of applying the substrate onto a test zone of the skin so that the adhesive surface is in contact with the skin at contact locations; removing the substrate; and evaluating the image formed on the adhesive surface. The image results from the modification of the adhesive surface at the contact locations. In a preferred embodiment, the adhesive surface, when applied to the skin, is not in appreciable contact with the sunken zones of the skin, such as the wrinkles or lines.

Abstract: A process, system, and kit for evaluating the relief of the skin using a substrate with an adhesive surface. The process includes the steps of applying the substrate onto a test zone of the skin so that the adhesive surface is in contact with the skin at contact locations; removing the substrate; and evaluating the image formed on the adhesive surface. The image results from the modification of the adhesive surface at the contact locations. In a preferred embodiment, the adhesive surface, when applied to the skin, is not in appreciable contact with the sunken zones of the skin, such as the wrinkles or lines.

Abstract: A process, system, and kit for evaluating the relief of the skin using a substrate with an adhesive surface. The process includes the steps of applying the substrate onto a test zone of the skin so that the adhesive surface is in contact with the skin at contact locations; removing the substrate; and evaluating the image formed on the adhesive surface. The image results from the modification of the adhesive surface at the contact locations. In a preferred embodiment, the adhesive surface, when applied to the skin, is not in appreciable contact with the sunken zones of the skin, such as the wrinkles or lines.

Abstract: A process, system, and kit for evaluating the relief of the skin using a substrate with an adhesive surface. The process includes the steps of applying the substrate onto a test zone of the skin so that the adhesive surface is in contact with the skin at contact locations; removing the substrate; and evaluating the image formed on the adhesive surface. The image results from the modification of the adhesive surface at the contact locations. In a preferred embodiment, the adhesive surface, when applied to the skin, is not in appreciable contact with the sunken zones of the skin, such as the wrinkles or lines.

Abstract: The invention concerns a method of making contactless smart cards. To facilitate the fixing of an integrated circuit chip in a contactless smart card, and in particular the chip connection with the antenna incorporated in the card, the method consists in soldering on the chip contact pads a gold wire with at least one end projecting above the chip. The wire is preferably soldered while the chip is still part of a semiconductor wafer. The wire can be soldered between two contact pads on a common chip; it can also be soldered between two contact pads of two adjacent chips on the wafer and then sawed during dicing. When the chip is incorporated in the card, it is pressed against the antenna so that the soldered wire is in contact with the coiled or printed antenna feeder end.

Abstract: An electronic chip device includes an interface support film having a support film and at least one flat conductive interface placed on the support film, as well as a microcircuit connected to the interface. The interface support film possesses such properties that it can be creased or folded on itself without deterioration. The support film possesses a thickness of less than 75 &mgr;m, the best results being obtained with a thickness of between 10 &mgr;m and 30 &mgr;m. Preferably the support film is selected from among polypropylene (PP), polyethylene (PE), polyethylene teraphtalate (PET). In one embodiment, the device includes a compensation film placed on the support film. The compensation film has a recess containing the microcircuit and its connections. The recess can contain a material to encapsulate the microcircuit and its connections.

Abstract: An electronic chip device includes an interface support film having a support film and at least one flat conductive interface placed on the support film, as well as a microcircuit connected to the interface. The interface support film possesses such properties that it can be creased or folded on itself without deterioration. The support film possesses a thickness of less than 75 &mgr;m, the best results being obtained with a thickness of between 10 &mgr;m and 30 &mgr;m. Preferably the support film is selected from among polypropylene (PP), polyethylene (PE), polyethylene teraphtalate (PET). In one embodiment, the device includes a compensation film placed on the support film. The compensation film has a recess containing the microcircuit and its connections. The recess can contain a material to encapsulate the microcircuit and its connections.

Abstract: An aqueous sodium hypochlorite solution (3) is added, in a quantity which is deficient relative to that required to decompose the entire amount of calcium chloride, to an aqueous calcium chloride solution (2), the sodium chloride which precipitates (6) is separated and the remaining amount (9) of the sodium hypochlorite solution is then added to the resulting mother-liquor (7). Single FIGURE.