Patents by Inventor Pierre-Jean Y. Parodi-Keravec

Pierre-Jean Y. Parodi-Keravec has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Protected interconnect for solid state camera module
    Patent number: 11150438
    Abstract: A camera module includes a solid state lens that flexes, in response to electrical signals. A lens barrel holds the lens on the optical axis. A lens barrel holder holds the lens barrel above an image sensor. The lens barrel holder includes electrically conductive interconnects between a bottom and a top end of the lens barrel holder. The conductive interconnects are not exposed to an exterior of the lens barrel holder. The camera module includes two or more respective lower electrically conductive connections in proximity to the interconnects and connecting the electrically conductive interconnects to respective conductors for the one or more electrical signals. The camera module includes two or more upper conductive connections configured to electrically connect the solid state lens to respective ones of the two or more conductive interconnects.
    Type: Grant
    Filed: August 9, 2017
    Date of Patent: October 19, 2021
    Assignee: Apple Inc.
    Inventors: Ya Wen Hsu, Pierre-Jean Y. Parodi-Keravec, Steven Webster
  • PROTECTED INTERCONNECT FOR SOLID STATE CAMERA MODULE
    Publication number: 20190179107
    Abstract: A camera module includes a solid state lens that flexes, in response to electrical signals. A lens barrel holds the lens on the optical axis. A lens barrel holder holds the lens barrel above an image sensor. The lens barrel holder includes electrically conductive interconnects between a bottom and a top end of the lens barrel holder. The conductive interconnects are not exposed to an exterior of the lens barrel holder. The camera module includes two or more respective lower electrically conductive connections in proximity to the interconnects and connecting the electrically conductive interconnects to respective conductors for the one or more electrical signals. The camera module includes two or more upper conductive connections configured to electrically connect the solid state lens to respective ones of the two or more conductive interconnects.
    Type: Application
    Filed: August 9, 2017
    Publication date: June 13, 2019
    Applicant: Apple Inc.
    Inventors: Ya Wen Hsu, Pierre-Jean Y. Parodi-Keravec, Steven Webster