Abstract: A modular siding panel for mortarless application to a building structure is disclosed, which includes a structure for capturing and draining infiltrated water within the panel. In a preferred embodiment, the siding panel includes a rigid facing panel made of weather resistant material and having a front face exposed in an installed condition of the panel and top, bottom and side edges for engagement with like panels positioned adjacent thereto; and a supporting spacer fastened to the rear surface of the facing panel, the spacer including a mounting portion for attachment of the siding panel to the building structure and a water management portion for capturing infiltrated water which has seeped past the front face along one or more of the edges and draining the captured infiltrated water while sealed within the modular siding panel and away from the building structure.

Abstract: A modular siding panel for mortarless application to a building structure is disclosed, which includes a structure for capturing and draining infiltrated water within the panel. In a preferred embodiment, the siding panel includes a rigid facing panel made of weather resistant material and having a front face exposed in an installed condition of the panel and top, bottom and side edges for engagement with like panels positioned adjacent thereto; and a supporting spacer fastened to the rear surface of the facing panel, the spacer including a mounting portion for attachment of the siding panel to the building structure and a water management portion for capturing infiltrated water which has seeped past the front face along one or more of the edges and draining the captured infiltrated water while sealed within the modular siding panel and away from the building structure.

Abstract: A pre-cast siding panel for mortarless application to a building structure is disclosed, which includes a structure for capturing and draining infiltrated water away from the building structure. In a preferred embodiment, the siding panel includes a cast facing panel made of settable material and having a front face exposed in an installed condition of the panel and top, bottom and side edges for engagement with like panels positioned adjacent thereto; and a supporting spacer partially embedded in the rear surface of the facing panel, the spacer including a mounting portion for fastening the siding panel to the building structure and a water management portion for managing infiltrated water away from the building structure, by capturing infiltrated water which has seeped past the front face along one or more of the edges and draining the captured infiltrated water away from the building structure.

Abstract: A pre-cast siding panel for mortarless application to a building structure is disclosed, which includes a structure for capturing and draining infiltrated water away from the building structure. In a preferred embodiment, the siding panel includes a cast facing panel made of settable material and having a front face exposed in an installed condition of the panel and top, bottom and side edges for engagement with like panels positioned adjacent thereto; and a supporting spacer partially embedded in the rear surface of the facing panel, the spacer including a mounting portion for fastening the siding panel to the building structure and a water management portion for managing infiltrated water away from the building structure, by capturing infiltrated water which has seeped past the front face along one or more of the edges and draining the captured infiltrated water away from the building structure.

Abstract: An apparatus for subdividing a sheet of brittle insulating material with a plurality of semiconductor chips disposed thereon. The chips are separated by row and column kerfs each of which contains a respective scribed line. The subdivision of the sheet is accomplished by placing the sheet in a flexible conformable carrier having an open grid, formed of ribs, with each rib positioned over a respective scribe line on the surface of the sheet and forcing the sheet against an arched anvil, thereby fracturing the sheet along the scribe lines.

Abstract: A method and an apparatus for subdividing a sheet of brittle insulating material (a silicon wafer substrate) with a plurality of semiconductor chips disposed thereon and electrically bonded to respective underlying circuit blocks printed on the sheet to provide each chip with its own substrate. The chips are arranged in rows and columns separated by row and column kerfs each of which contains a respective scribed line.