Patents by Inventor Pierre MONTAUFRAY

Pierre MONTAUFRAY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230038948
    Abstract: Disclosed is a bonded assembly comprising at least: a first substrate, a second substrate, an intermediate deformation layer secured to the first substrate, the intermediate deformation layer comprising a material in which cavities are provided so that the intermediate deformation layer has a stiffness which is variable along a direction parallel to the intermediate deformation layer, an adhesive between the intermediate layer and the second substrate.
    Type: Application
    Filed: December 15, 2020
    Publication date: February 9, 2023
    Inventors: Jean-Philippe COURT, Hamza ABBAD EL ANDALOUSSI, Firas SAYED AHMAD, Pierre MONTAUFRAY, Alexandre MONTEIL, Thierry ROURE