Abstract: The present disclosure relates to a process of manufacturing a pressure sensitive adhesive, comprising the steps of: a) providing a hot melt mixing apparatus comprising a reaction chamber; b) providing a hot melt processable pressure sensitive adhesive composition comprising: (1) a (meth)acrylate copolymer component comprising: i. C1-C32 (meth)acrylic acid ester monomer units; ii. optionally, ethylenically unsaturated monomer units having functional groups selected from the group consisting of acid, hydroxyl, acid anhydride, epoxide, amine, amide groups, and any combinations thereof; and iii.

Abstract: The present disclosure relates to an electronic device comprising at least one organic light-emitting diode and a pressure sensitive adhesive composition comprising a synthetic rubber block (co)polymer, and wherein the pressure sensitive adhesive composition has: a) a relative permittivity no greater than 2.50, when measured at an alternating current frequency of 100 kHz according to the test method described in the experimental section; b) a water uptake no greater than 0.60 wt %, when measured after exposure to 60° C. and 95% relative humidity for 120 hours, according to the test method described in the experimental section; and c) optionally, a peel adhesion value above 0.20 N/mm, when measured at 85° C. according to the test method described in the experimental section.

Abstract: The present disclosure relates to a process of manufacturing a pressure sensitive adhesive, comprising the steps of: a) providing a hot melt mixing apparatus comprising a reaction chamber; b) providing a hot melt processable pressure sensitive adhesive composition comprising: (1) a (meth)acrylate copolymer component comprising: i. C1-C32 (meth)acrylic acid ester monomer units; ii. optionally, ethylenically unsaturated monomer units having functional groups selected from the group consisting of acid, hydroxyl, acid anhydride, epoxide, amine, amide groups, and any combinations thereof; and iii.

Abstract: The present disclosure relates to a process of manufacturing a pressure sensitive adhesive, comprising the steps of: a) providing a hot melt mixing apparatus; b) providing a hot melt processable pressure sensitive adhesive composition contained within a packaging material and forming a packaged pressure sensitive adhesive composition; c) providing a thermal crosslinking system; d) mixing the hot melt processable pressure sensitive adhesive composition and the thermal crosslinking system in the hot melt mixing apparatus thereby forming a hot melt blend, wherein the packaging material is melted and mixable with the hot melt blend; e) removing the hot melt blend from the hot melt mixing apparatus; and f) optionally, thermally crosslinking the hot melt blend.

Abstract: The present disclosure relates to a process of manufacturing a pressure sensitive adhesive, comprising the steps of: a) providing a hot melt mixing apparatus comprising a reaction chamber; b) providing a hot melt processable pressure sensitive adhesive composition comprising: (1) a (meth)acrylate copolymer component comprising: i. C1-C32 (meth)acrylic acid ester monomer units; ii. optionally, ethylenically unsaturated monomer units having functional groups selected from the group consisting of acid, hydroxyl, acid anhydride, epoxide, amine, amide groups, and any combinations thereof; and iii.

Abstract: The present disclosure relates to an electronic device comprising at least one organic light-emitting diode and a pressure sensitive adhesive composition comprising a synthetic rubber block (co)polymer, and wherein the pressure sensitive adhesive composition has: a) a relative permittivity no greater than 2.50, when measured at an alternating current frequency of 100 kHz according to the test method described in the experimental section; b) a water uptake no greater than 0.60 wt %, when measured after exposure to 60° C. and 95% relative humidity for 120 hours, according to the test method described in the experimental section; and c) optionally, a peel adhesion value above 0.20 N/mm, when measured at 85° C. according to the test method described in the experimental section.

Abstract: The present disclosure relates to a curable pressure sensitive adhesive composition comprising: a) a butyl rubber component in an amount greater than 40 wt %; b) a tackifier in an amount greater than 1 wt %; c) a multifunctional crosslinking agent comprising at least two nitroso functional groups; and d) optionally, a hydrocarbon plasticizer; wherein the weight percentages are based on the total weight of the curable pressure sensitive adhesive composition. In another aspect, the present disclosure is directed to a method for protecting an electronic device or an electronic component from moisture and air permeation, wherein the method comprises the step of using a pressure sensitive adhesive composition as described above. According to still another aspect, the present disclosure is directed to the use of a pressure sensitive adhesive composition as described above for manufacturing an electronic device.

Abstract: An adhesive composition are articles are described. The adhesive composition comprises a polyisobutylene polymer component; up to 20 wt.-% of a polyolefin copolymer comprising polymerized units of an acidic monomer; and optionally, at least one tackifier. The polyolefin copolymer typically comprises C2-C4 alkylene units. The polyolefin copolymer comprises polymerized units of a carboxylic acid, or unsaturated derivative thereof. In some embodiments, the polyolefin copolymer has a melting temperature ranging from 50 to 150° C. In some embodiments, the polyolefin copolymer has an acid number of less than 40, 35, 30, or 25 mgKOH/g.

Abstract: The present disclosure relates to a pressure sensitive adhesive comprising: a) a multi-arm block copolymer of the formula Qn-Y, wherein: (i) Q represents an arm of the multi-arm block copolymer and each arm independently has the formula G-R, (ii) n represents the number of arms and is a whole number of at least 3, and (iii) Y is the residue of a multifunctional coupling agent, wherein each R is a rubbery block comprising a polymerized conjugated diene, a hydrogenated derivative of a polymerized conjugated diene, or combinations thereof; and each G is a glassy block comprising a polymerized monovinyl aromatic monomer; b) a polymeric plasticizer having a weight average molecular weight Mw comprised between 10.000 and 100.

Abstract: The present disclosure is directed to a curable precursor of a pressure sensitive adhesive comprising a) a (co)polymeric material comprising a rubber-based elastomeric material; b) a polyfunctional aziridine curing agent; and c) an acid generating agent. The present disclosure is also directed to a method of manufacturing such pressure sensitive adhesives and uses thereof.

Abstract: Low Volatile Organic Content (VOC) thermal interface materials are described. The thermal interface materials include heat conducting fillers such a hexagonal boron nitride dispersed in a block copolymer resin system. Depending on the requirements, tackifiers and plasticizers may be included in the resin system while still retaining low VOC levels.

Abstract: The present disclosure is directed to a curable precursor of a pressure sensitive adhesive comprising a) a (co)polymeric material comprising a rubber-based elastomeric material; b) a polyfunctional aziridine curing agent; and c) an acid generating agent. The present disclosure is also directed to a method of manufacturing such pressure sensitive adhesives and uses thereof.

Abstract: The present disclosure relates to a multilayer pressure sensitive adhesive assembly comprising a polymeric foam layer and a first pressure sensitive adhesive layer adjacent to the polymeric foam layer, wherein first the pressure sensitive adhesive comprises: a) a multi-arm block copolymer of the formula Qn-Y, wherein: (i) Q represents an arm of the multi-arm block copolymer and each arm independently has the formula G-R, (ii) n represents the number of arms and is a whole number of at least 3, and (iii) Y is the residue of a multifunctional coupling agent, ?wherein each R is a rubbery block comprising a polymerized conjugated diene, a hydrogenated derivative of a polymerized conjugated diene, or combinations thereof; and each G is a glassy block comprising a polymerized monovinyl aromatic monomer; b) a polymeric plasticizer having a weight average molecular weight Mw of at least 10,000 g/mol; c) at least one hydrocarbon tackifier, wherein the hydrocarbon tackifier(s) have a Volatile Organic Compound (VO

Abstract: The present disclosure relates to a pressure sensitive adhesive comprising: a) a multi-arm block copolymer of the formula Qn-Y, wherein: (i) Q represents an arm of the multi-arm block copolymer and each arm independently has the formula G-R, (ii) n represents the number of arms and is a whole number of at least 3, and (iii) Y is the residue of a multifunctional coupling agent, ?wherein each R is a rubbery block comprising a polymerized conjugated diene, a hydrogenated derivative of a polymerized conjugated diene, or any combinations thereof; and each G is a glassy block comprising a polymerized monovinyl aromatic monomer; b) a polymeric plasticizer having a weight average molecular weight Mw of at least 10,000 g/mol; c) at least one hydrocarbon tackifier, wherein the hydrocarbon tackifier(s) have a Volatile Organic Compound (VOC) value of less than 1000 ppm, when measured by thermogravimetric analysis according to the weight loss test methods described in the experimental section; and d) optionally, a l

Abstract: Adhesive composition are described comprising the reaction product of at least one halogenated copolymer of isobutylene wherein halogen atoms of the copolymer are replaced by a polyamine having a melting point greater than 25° C., thereby crosslinking the copolymer. The isobutylene copolymer comprises halogenated repeat units derived from isoprene, butadiene, para-alkyl styrene, or a combination thereof. The adhesive composition comprises a copolymer of isobutylene repeat units and second repeat units selected from alkene repeat units, para-methyl styrene repeat units, or a combination thereof wherein at least a portion of the second repeat units are directly bonded to one another with a polyamine crosslinker having a melting point greater than 25° C. Also described are adhesive articles, such as tapes, comprising such adhesives.

Abstract: Adhesive composition are described comprising the reaction product of at least one halogenated copolymer of isobutylene wherein halogen atoms of the copolymer are replaced by a polyamine having a melting point greater than 25° C., thereby crosslinking the copolymer. The isobutylene copolymer comprises halogenated repeat units derived from isoprene, butadiene, para-alkyl styrene, or a combination thereof. The adhesive composition comprises a copolymer of isobutylene repeat units and second repeat units selected from alkene repeat units, para-methyl styrene repeat units, or a combination thereof wherein at least a portion of the second repeat units are directly bonded to one another with a polyamine crosslinker having a melting point greater than 25° C. Also described are adhesive articles, such as tapes, comprising such adhesives.

Abstract: The present invention relates to a curable adhesive composition comprising a first part and a second part, the curable adhesive composition comprising: in the first part at least one epoxy resin and in the second part at least one curing agent in the form of an epoxy-amine and/or epoxy-thiol adduct obtainable by reacting at least one primary amine, secondary amine and/or a thiol with at least one polyol compound comprising at least one terminal epoxy group.