Patents by Inventor Pierson S. Kang

Pierson S. Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6968769
    Abstract: A die assembly including a first die with a first die surface and a first cutting rib extending from the first die surface. The first cutting rib includes a first cutting surface parallel to the first die surface. The first cutting rib includes a leg extending from the first die surface to the first cutting surface at a first obtuse angle. A second die includes a second die surface and a second cutting rib extending from the second die surface. The second cutting rib includes a second cutting surface parallel to the second die surface. The second cutting surface is generally parallel to and defines a cutting overlap with the first cutting surface at a cross-section taken through the first and second dies in a cutting position. The cutting rib includes a leg extending from the second die surface to the second cutting surface at a second obtuse angle.
    Type: Grant
    Filed: September 10, 2002
    Date of Patent: November 29, 2005
    Assignee: Xynatech, Inc.
    Inventor: Pierson S. Kang
  • Publication number: 20040045427
    Abstract: A die assembly including a first die with a first die surface and a first cutting rib extending from the first die surface. The first cutting rib includes a first cutting surface parallel to the first die surface. The first cutting rib includes a leg extending from the first die surface to the first cutting surface at a first obtuse angle. A second die includes a second die surface and a second cutting rib extending from the second die surface. The second cutting rib includes a second cutting surface parallel to the second die surface. The second cutting surface is generally parallel to and defines a cutting overlap with the first cutting surface at a cross-section taken through the first and second dies in a cutting position. The cutting rib includes a leg extending from the second die surface to the second cutting surface at a second obtuse angle.
    Type: Application
    Filed: September 10, 2002
    Publication date: March 11, 2004
    Applicant: Xynatech, Inc.
    Inventor: Pierson S. Kang
  • Patent number: 6223641
    Abstract: A paper product has a first sheet with a pattern of spaced openings permitting separation into sections and a second sheet releasably attached to the first sheet with a pattern of continuous curvilinear openings dividing the sheet into sections and being aligned with the openings of the first sheet. A die sheet for a die for cutting material includes a die sheet surface with a die pattern extending outwardly from the die sheet surface. The die pattern has slitting sections providing curvilinear, continuous openings through a second sheet of the material and spaced perforating sections extending above the slitting sections providing a pattern of spaced openings in the first sheet adjacent to the openings through the second sheet. A first method of constructing a die sheet includes covering a die surface with a first, spaced pattern of a first photo-resist material and then covering the first pattern with a second, continuous pattern of a second photo-resist material.
    Type: Grant
    Filed: November 12, 1996
    Date of Patent: May 1, 2001
    Assignee: Xynatech, Inc.,
    Inventor: Pierson S. Kang
  • Patent number: 6136209
    Abstract: A first method of constructing a die sheet includes covering a die surface with a first, spaced pattern of a first photo-resist material and then covering the first pattern with a second, continuous pattern of a second photo-resist material. A chemical removes material from sections not covered by the second pattern and the second pattern is then removed. A chemical removes material from die surface sections not covered by the first pattern. A second method of constructing a die sheet includes covering sections of a die surface with a pattern of photo-resist material having alternating slitting segments and wider perforating segments. A chemical removes material from uncovered sections and completely undercuts the slitting segments to form slitting sections and undercuts the perforating segments to form higher extending perforating sections.
    Type: Grant
    Filed: May 23, 1997
    Date of Patent: October 24, 2000
    Assignee: Xynatech, Inc.
    Inventor: Pierson S. Kang
  • Patent number: 5789050
    Abstract: A paper product has a first sheet with a pattern of spaced openings permitting separation into sections and a second sheet releasably attached to the first sheet with a pattern of continuous curvilinear openings dividing the sheet into sections and being aligned with the openings of the first sheet. A die sheet for a die for cutting material includes a die sheet surface with a die pattern extending outwardly from the die sheet surface. The die pattern has slitting sections providing curvilinear, continuous openings through a second sheet of the material and spaced perforating sections extending above the slitting sections providing a pattern of spaced openings in the first sheet adjacent to the openings through the second sheet. A first method of constructing a die sheet includes covering a die surface with a first, spaced pattern of a first photo-resist material and then covering the first pattern with a second, continuous pattern of a second photo-resist material.
    Type: Grant
    Filed: May 23, 1997
    Date of Patent: August 4, 1998
    Assignee: Xynatech, Inc.
    Inventor: Pierson S. Kang
  • Patent number: 5488889
    Abstract: A cutting die for cutting materials is provided. A die sheet having opposing front and back die sheet surfaces is provided. At least one cutting edge defining a die pattern is formed extending outwardly from a portion of the front sheet surface. A spacer abutment extending outwardly from a portion of the back surface of the die sheet is also provided. The spacer abutment is disposed in alignment with the cutting edge. A pressure surface is provided for applying the die sheet to the materials. An abutment surface of the spacer is abutted directly against the carrier surface in order to dispose the cutting edge a predetermined distance from the pressure surface. Cavities formed between adjacent abutments may be filled with an adhesive material in order to secure the cutting die to the pressure surface. The cutting die may be flexible and may be adhesively secured to a cylindrical die carrier.
    Type: Grant
    Filed: September 20, 1993
    Date of Patent: February 6, 1996
    Assignee: Xynatech, Inc.
    Inventor: Pierson S. Kang
  • Patent number: 5379671
    Abstract: A magnetic saddle apparatus for mounting magnetic etched dies onto rotating cylinders and including a segment of a cylinder wall, on an outer surface of which an array of permanent magnets is adhered, a mounting arrangement for fastening the saddle apparatus to a die-cutting cylinder, and a gripping bar, which prevents slippage of small area etched dies during operation of the cutting cylinder.
    Type: Grant
    Filed: February 16, 1993
    Date of Patent: January 10, 1995
    Assignee: Xynatech, Inc.
    Inventor: Pierson S. Kang
  • Patent number: 4195557
    Abstract: A die set for cutting, scoring and embossing sheet material comprises a first die having cutting rules, scoring rules and embossing means attached to a base, a mating die cooperating with the first die having mating embossing means for cooperating with the first embossing means on the first die and registering means on the first die and the mating die for ensuring proper registration of the first embossing means and the mating embossing means.
    Type: Grant
    Filed: June 29, 1978
    Date of Patent: April 1, 1980
    Assignee: Chem Par Corporation
    Inventor: Pierson S. Kang
  • Patent number: 4112827
    Abstract: A die set for cutting, scoring and embossing sheet material comprises a first die having cutting rules, scoring rules and embossing means attached to a base, a mating die cooperating with the first die having mating embossing means for cooperating with the first embossing means on the first die and registering means on the first die and the mating die for ensuring proper registration of the first embossing means and the mating embossing means.
    Type: Grant
    Filed: June 3, 1977
    Date of Patent: September 12, 1978
    Assignee: ChemPar Corporation
    Inventor: Pierson S. Kang