Abstract: A method and apparatus are discloses for wirebonding leads of a plurality of lead frames being part of a lead frame assembly by a wirebonding tool to semiconductor products mounted on the respective lead frames. The semiconductor products are clamped by a clamping mechanism comprising a stationary clamp and a movable clamp. The movable clamp follows the indexing movement of the lead frame assembly during wirebonding of the semiconductor products clamped by the movable clamp. The wirebonding process does not need to be interrupted for the indexing.

Abstract: A method and apparatus are discloses for wirebonding leads of a plurality of lead frames being part of a lead frame assembly by a wirebonding tool to semiconductor products mounted on the respective lead frames. The semiconductor products are clamped by a clamping mechanism comprising a stationary clamp and a movable clamp. The movable clamp follows the indexing movement of the lead frame assembly during wirebonding of the semiconductor products clamped by the movable clamp. The wirebonding process does not need to be interrupted for the indexing.

Abstract: Electrostatic displacement devices (1) with high forces and high accelerations are provided by arranging the electrodes (31, 31a, 31b) such that an electric field is generated extending over an area equivalent to the surface area of the object (2) to be displaced. Preferably, higher voltages are applied to the electrodes (31a) in the edge region than to the electrodes (31b) in the middle region, to further increase the shear forces inducing the actual displacement.

Abstract: A method and apparatus are discloses for wirebonding leads of a plurality of lead frames being part of a lead frame assembly by a wirebonding tool to semiconductor products mounted on the respective lead frames. The semiconductor products are clamped by a clamping mechanism comprising a stationary clamp and a movable clamp. The movable clamp follows the indexing movement of the lead frame assembly during wirebonding of the semiconductor products clamped by the movable clamp. The wirebonding process does not need to be interrupted for the indexing.

Abstract: The invention relates to a system (1) for detecting motion of a body (2), said body comprising a first diffraction pattern (3A) and a second diffraction pattern (3B) with a predetermined orientation relative to said first diffraction pattern. The system comprises optical means (4A, 4B) adapted to provide at least a first incident beam to said first diffraction pattern to obtain a first diffracted beam from said first diffraction pattern and at least a second incident beam, with a predetermined orientation relative to said first incident beam, to said second diffraction pattern to obtain a second diffracted beam from said second diffraction pattern. The system has means for detecting motion of said body on the basis of the phase difference between at least one of said first diffracted beam and said second diffracted beam. Accordingly a larger in-plane rotation range is obtained for detecting motion of the body (2).

Abstract: The invention relates to a system (1) for detecting a translation (T) of a body (2) with a diffraction pattern (3) applied to said body. The system comprises means (4) for providing an incident light beam (I) to said diffraction pattern and to obtain a diffracted light beam (D) from said diffraction pattern; means (4) for measuring a phase difference by interference between said incident light beam and said diffracted beam an means (4) for detecting said translation on the basis of said measured phase difference. The invention further relates to a method for detecting a translation of a body (2); a redirection arrangement 6 and a frequency multiplexing system.

Abstract: A composite material (10, 20) includes a substrate (12, 22) with an electrically conducting metal or metal oxide surface (22B), a layer (14, 24) of an electrically insulating material such as parylene, and an intermediate adhesion-improving metal layer (16, 26) between the substrate and the electrically insulating layer. A fluid focus lens (30) has first and second fluids (32, 34) and first and second electrodes, the first electrode comprising a core (38) of the composite material (10, 20) with the electrically insulating layer (41) positioned between the core (38) and the fluids (32, 34), and the second electrode (50) in contact with the second fluid (34).

Abstract: The electrowetting cell (15) comprises an outer wall (90) and an inner wall (80), said outer wall (90) being provided with extensions (85, 86) extending at opposing sides of the inner wall (80). The cell (15) is further provided with a membrane (45) for volume expansion and is sealed through an electroplated layer (95).

Abstract: A method and apparatus are discloses for wirebonding leads of a plurality of lead frames being part of a lead frame assembly by a wirebonding tool to semiconductor products mounted on the respective lead frames. The semiconductor products are clamped by a clamping mechanism comprising a stationary clamp and a movable clamp. The movable clamp follows the indexing movement of the lead frame assembly during wirebonding of the semiconductor products clamped by the movable clamp. The wirebonding process does not need to be interrupted for the indexing.