Patents by Inventor Pieter H. Bellaar

Pieter H. Bellaar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microelectronic component with rigid interposer
    Patent number: 6208025
    Abstract: A microelectronic component for mounting a rigid substrate, such as a hybrid circuit to a rigid support substrate, such as a printed circuit board. The microelectronic component includes a rigid interposer which may have a chip mounted on its first surface; a pattern of contacts on the rigid interposer; a flexible interposer overlying the second surface of the rigid interposer; a pattern of terminals on the flexible interposer; flexible leads; and solder coated copper balls mounted on the flexible interposer. The microelectronic component may have a socket assembly mounted on the first surface of the rigid interposer. The microelectronic component may be mounted on a rigid support substrate.
    Type: Grant
    Filed: October 6, 1999
    Date of Patent: March 27, 2001
    Assignee: Tessera, Inc.
    Inventors: Pieter H. Bellaar, Thomas H. Distefano, Joseph Fjelstad, Christopher M. Pickett, John W. Smith
  • Microelectronic component with rigid interposer
    Patent number: 6002168
    Abstract: A microelectronic component for mounting a rigid substrate, such as a hybrid circuit to a rigid support substrate, such as a printed circuit board. The microelectronic component includes a rigid interposer which may have a chip mounted on its first surface; a pattern of contacts on the rigid interposer; a flexible interposer overlying the second surface of the rigid interposer; a pattern of terminals on the flexible interposer; flexible leads; and solder coated copper balls mounted on the flexible interposer. The microelectronic component may have a socket assembly mounted on the first surface of the rigid interposer. The microelectronic component may be mounted on a rigid support substrate.
    Type: Grant
    Filed: November 25, 1997
    Date of Patent: December 14, 1999
    Assignee: Tessera, Inc.
    Inventors: Pieter H. Bellaar, Thomas H. DiStefano, Joseph Fjelstad, Christopher M. Pickett, John W. Smith
  • Stacked chip assembly
    Patent number: 5861666
    Abstract: An assembly of semiconductor chips has the chips vertically stacked above one another. Interposers extending between adjacent chips have compliant layers to accommodate thermal expansion of the chips. Desirably, the interposers have metallic plates to conduct heat from the interior of the stack.
    Type: Grant
    Filed: August 29, 1996
    Date of Patent: January 19, 1999
    Assignee: Tessera, Inc.
    Inventor: Pieter H. Bellaar