Patents by Inventor Pieter H. Zuuring

Pieter H. Zuuring has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing a multilayer printed wire board
    Patent number: 5633072
    Abstract: A process for manufacturing a multi-layer printed wire board, also referred to as a multilayer, comprising at least two electrically insulating substrates with electrically conductive traces or layers provided on at least three surfaces thereof, in which process, by means of lamination under pressure, a cured basic substrate based on a UD-reinforced synthetic material, provided on either side with traces, is combined with and bonded to a back-up substrate, wherein during the laminating process the back-up substrate is added to the basic substrate, the back-up substrate comprising a UD-reinforced cured core layer provided at least on the side facing the conducting traces of the basic substrate with a still plastically deformable (flowable) adhesive layer, and such a pressure is exerted on the laminate as to bring said cured core layer of the back-up substrate into contact or practically into contact with the conducting traces of the basic substrate, and the space between these traces is filled with the adhesiv
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: May 27, 1997
    Assignee: Akzo Nobel N.V.
    Inventors: Erik Middelman, Pieter H. Zuuring
  • Method of manufacturing a multilayer printed wire board
    Patent number: 5592737
    Abstract: A process for manufacturing a multi-layer printed wire board, also referred to as a multilayer, comprising at least two electrically insulating substrates with electrically conductive traces or layers provided on at least three surfaces thereof, in which process, by means of lamination under pressure, a cured basic substrate based on a UD-reinforced synthetic material, provided on either side with traces, is combined with and bonded to a back-up substrate, wherein during the laminating process the back-up substrate is added to the basic substrate, the back-up substrate comprising a UD-reinforced cured core layer provided at least on the side facing the conducting traces of the basic substrate with a still plastically deformable (flowable) adhesive layer, and such a pressure is exerted on the laminate as to bring said cured core layer of the back-up substrate into contact or practically into contact with the conducting traces of the basic substrate, and the space between these traces is filled with the adhesiv
    Type: Grant
    Filed: December 3, 1993
    Date of Patent: January 14, 1997
    Assignee: Akzo Nobel N.V.
    Inventors: Erik Middelman, Pieter H. Zuuring
  • Printed wire boards and method of making same
    Patent number: 5496613
    Abstract: A laminate, adapted to be used as a supporting board for a printed circuit, is disclosed which comprises layers of an electrically non-conductive matrix material reinforced with unidirectionally (UD) oriented fibers with the layers comprising individual matrix material having different directions of orientation. The layers are stacked to form a laminate of crossing layers, and the laminate has a core plane relative to which the crossing layers are in mirror image relationship so that the laminate has orthotropic properties. The laminate comprises layers of adhesive material present at least between any pair of layers of UD-reinforced matrix material having different directions of orientation.
    Type: Grant
    Filed: December 2, 1993
    Date of Patent: March 5, 1996
    Assignee: AMP-Akzo LinLim VOF
    Inventors: Erik Middelman, Pieter H. Zuuring
  • Interpenetrating network of ring-containing allyl polymers and epoxy resin laminate
    Patent number: 5391435
    Abstract: A polymeric material used in laminates with metal comprises an interpenetrating polymer network composed of a cyclic moiety-containing pollyallyl compound optionally with an aromatic difunctional compound (co)polymerized and cross-linked in the presence of a free radical initiator, and an epoxy resin cross-linked with a polyhydric phenol.
    Type: Grant
    Filed: December 8, 1992
    Date of Patent: February 21, 1995
    Assignee: Akzo Nobel N.V.
    Inventors: Jan A. J. Schutyser, Antonius J. W. Buser, Pieter H. Zuuring, Hendrik J. Slot
  • Interpenetrating network of ring-containing allyl polymers and epoxy resin, and a laminate prepared therefrom
    Patent number: 5210157
    Abstract: A polymeric material used in laminates with metal-comprises an interpenetrating polymer network composed of a cyclic moiety-containing pollyallyl compound optionally with an aromatic difunctional compound (co)polymerized and cross-linked in the presence of a free radical initiator, and an epoxy resin cross-linked with a polyhydric phenol.
    Type: Grant
    Filed: August 7, 1990
    Date of Patent: May 11, 1993
    Assignee: Akzo N.V.
    Inventors: Jan A. J. Schutyser, Antonius J. W. Buser, Pieter H. Zuuring, Hendrik J. Slots
  • Interpenetrating polymer network of epoxy resin, polyallyl polymer and anhydride
    Patent number: 5110867
    Abstract: Polymeric materials comprising an interpenetrating network (IPN) prepared from allyl polymers and epoxy resins. The allyl polymers are crosslinked under the influence of a radical initiator, the epoxy resin is crosslinked by a curing agent. The curing agent is a cyclic anhydride containing a polymerizable double bond. The two networks are interlinked as a result of the double bond being involved in the curing reaction of the allyl polymers. The cyclic anhydride preferably is maleic anhydride. Preferred IPN's are prepared form triallylcyanurate or triallylisocyanurate-based allyl polymers and phenol-type epoxy resin.
    Type: Grant
    Filed: September 12, 1990
    Date of Patent: May 5, 1992
    Assignee: Akzo NV
    Inventors: Jan A. J. Schutyser, Antonius J. W. Buser, Pieter H. Zuuring, Hendrik J. Slots