Abstract: A process for manufacturing a multi-layer printed wire board, also referred to as a multilayer, comprising at least two electrically insulating substrates with electrically conductive traces or layers provided on at least three surfaces thereof, in which process, by means of lamination under pressure, a cured basic substrate based on a UD-reinforced synthetic material, provided on either side with traces, is combined with and bonded to a back-up substrate, wherein during the laminating process the back-up substrate is added to the basic substrate, the base substrate and the back-up substrate comprising a UD-reinforced cured core layer, the base substrate having been provided at least on the side facing the back-up substrate with a still plastically deformable (flowable) adhesive layer, and such a pressure is exerted on the laminate as to bring said back-up substrate into contact or practically into contact with the conducting traces of the basic substrate, and the space between these traces is filled with the

Abstract: The invention relates to a method of manufacturing a composite laminate, preferably a cross-ply laminate, in which process unidirectionally oriented (UD) fibres (3) are provided with matrix material (7) and, together with a pre-formed non-flowing UD composite or cross-ply laminate, passed through a laminating zone (13) in layers of at least two different orientational directions. More particularly, the invention relates to the manufacture of composite material which is pre-eminently suited to be used as a supporting substrate for printed wire boards. The method according to the invention is directed in particular to the utilisation of a double belt press, both for making the preformed non-flowing UD composite and for the manufacture of the final laminate. The invention also comprises printed wire board (PWBs) and multilayer PWBs.