Abstract: In some embodiments, a radio-frequency device can be manufactured by a method that includes forming or providing a substrate, fabricating or providing a flip chip die having a front side and a back side, and including an integrated circuit implemented on the front side, and mounting the front side of the flip chip die on the substrate. The method can further include implementing a shielding component over the back side of the flip chip die to provide electromagnetic shielding between a first region within or on the flip chip die and a second region away from the flip chip die.

Abstract: A temperature sensor circuit for sensing the temperature of an electronic component is disclosed. The temperature sensor circuit comprises a first transistor configured to be thermally isolated from the electronic component and being configured to sense an ambient temperature and a second transistor configured to be thermally linked to the electronic component and being configured to sense a temperature at the electronic component. The temperature sensor circuit is a differential circuit having a first path and a second path with the first and second transistors being arranged on the first and second paths of the differential circuit, respectively, such that the temperature sensor circuit generates an output voltage inversely proportional to a temperature difference between the ambient temperature and the temperature at the electronic component. The temperature sensor circuit also comprises a shut-off switch configured to activate or deactivate the temperature sensor circuit.

Abstract: A variable attenuator circuit is disclosed. The variable attenuator circuit comprises a plurality of varactor diodes configured to attenuate an RF signal between an RF input and an RF output; a reference voltage input, and a control voltage input configured to vary the attenuation of the variable attenuator circuit based upon a control voltage. A radio frequency module and wireless device comprising said variable attenuator are also provided.

Abstract: A temperature controlled attenuator circuit is disclosed. The temperature controlled attenuator circuit comprises a temperature sensor circuit for sensing the temperature of an electronic component and generating a control voltage inversely proportional to a difference in temperature between an ambient temperature and the temperature of the electronic component and a variable attenuator circuit configured to vary its attenuation based upon the control voltage to provide an attenuation based upon the difference in temperature between the ambient temperature and the temperature of the electronic component. A radio frequency module and wireless device comprising said temperature controlled attenuator circuit are also provided.

Abstract: According to at least one example, an amplifier circuit includes an amplifier and a temperature sensor circuit. The temperature sensor circuit includes a first transistor thermally isolated from the amplifier and being configured to sense an ambient temperature, and a second transistor thermally linked to the amplifier and being configured to sense a temperature at the amplifier, the temperature sensor circuit being a differential circuit having a first path and a second path with the first and second transistors being arranged on the first and second paths of the differential circuit respectively. The temperature sensor circuit is configured to generate an output voltage inversely proportional to a temperature difference between the ambient temperature and the temperature at the amplifier.

Abstract: In some embodiments, a radio-frequency device can be manufactured by a method that includes forming or providing a substrate, fabricating or providing a flip chip die having a front side and a back side, and including an integrated circuit implemented on the front side, and mounting the front side of the flip chip die on the substrate. The method can further include implementing a shielding component over the back side of the flip chip die to provide electromagnetic shielding between a first region within or on the flip chip die and a second region away from the flip chip die.

Abstract: Shielding for flip chip devices. In some embodiments, a shielded assembly can include a substrate and a flip chip die having a front side and a back side, with the including an integrated circuit implemented on the front side, and the front side of the flip chip die being mounted to the substrate. The shielded assembly can further include a shielding component implemented over the back side of the flip chip die to provide electromagnetic shielding between a first region within or on the flip chip die and a second region away from the flip chip die.

Abstract: Shielding for flip chip devices. In some embodiments, a shielded assembly can include a substrate and a flip chip die having a front side and a back side, with the including an integrated circuit implemented on the front side, and the front side of the flip chip die being mounted to the substrate. The shielded assembly can further include a shielding component implemented over the back side of the flip chip die to provide electromagnetic shielding between a first region within or on the flip chip die and a second region away from the flip chip die.