Patents by Inventor Pik Ling Lau

Pik Ling Lau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metal foil laminated IC package
    Patent number: 6429048
    Abstract: A method of fabricating an integrated circuit package for ball grid arrays, comprising the steps of: laminating layers of fiberglass prepreg and copper foil to a copper plate in order to create a three-layer laminated carrier; patterning and etching contact pads for input/output and a power/ground ring; applying a solder mask and plating up the contact pads and the ring with a wire bondable metal surface; forming window openings for receiving semiconductor dies; attaching the dies within the windows, wire bonding the dies to the contact pads and the ring, encapsulating the dies, attaching solder balls to the contact pads to create finished packages and singulating the finished packages into individual packages; and attaching the copper plate portion of each of the individual packages to copper plate heat spreader.
    Type: Grant
    Filed: December 5, 2000
    Date of Patent: August 6, 2002
    Assignee: ASAT Ltd.
    Inventors: Neil McLellan, Chun Ho Fan, Kwok Cheung Tsang, Pik Ling Lau
  • METAL FOIL LAMINATED IC PACKAGE
    Publication number: 20020068378
    Abstract: A method of fabricating an integrated circuit package for ball grid arrays, comprising the steps of: laminating layers of fiberglass prepreg and copper foil to a copper plate in order to create a three-layer laminated carrier; patterning and etching contact pads for input/output and a power/ground ring; applying a solder mask and plating up the contact pads and the ring with a wire bondable metal surface; forming window openings for receiving semiconductor dies; attaching the dies within the windows, wire bonding the dies to the contact pads and the ring, encapsulating the dies, attaching solder balls to the contact pads to create finished packages and singulating the finished packages into individual packages; and attaching the copper plate portion of each of the individual packages to copper plate heat spreader.
    Type: Application
    Filed: December 5, 2000
    Publication date: June 6, 2002
    Applicant: ASAT Ltd.
    Inventors: Neil McLellan, Chun Ho Fan, Kwok Cheung Tsang, Pik Ling Lau