Patents by Inventor Pil Park

Pil Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145674
    Abstract: Provided is a positive electrode active material including a plurality of crystallites A, wherein the plurality of crystallites A has a crystallite long-axis orientation degree DoA represented by Equation 1 below is 0.5 to 1, and a crystallite c-axis orientation degree represented by a cross product value of a c-axis rotation vector Rc of a crystal lattice of a crystallite obtained by electron backscatter diffraction (EBSD) analysis and a position unit vector P? of the crystallite is 0.5 to 1. A proportion of the plurality of crystallites A is 25% to 80% with respect to a total number of crystallites in a cross-section of a positive electrode active material. Further provided is a positive electrode and a lithium secondary battery including the positive electrode active material.
    Type: Application
    Filed: March 22, 2022
    Publication date: May 2, 2024
    Applicants: LG Chem, Ltd., LG Chem, Ltd.
    Inventors: Won Sig Jung, Hwan Young Choi, Hyun Ah Park, Hyeon Hui Baek, Jong Pil Kim
  • Publication number: 20240145722
    Abstract: The present application can provide an electrode, a method of manufacturing an electrode, and a use of the electrode. The present application can provide an electrode without forming the fat edge portion while an insulating layer formed by overlapping with the electrode active material layer on the current collector layer of the electrode effectively secures the insulation required for the electrode. In addition, even when the electrode design model is changed, the present application can provide a manufacturing method capable of manufacturing the above-described electrode by flexibly responding to the relevant change. In addition, the present application can provide a use of the electrode.
    Type: Application
    Filed: July 15, 2022
    Publication date: May 2, 2024
    Applicant: LG ENERGY SOLUTION, LTD.
    Inventors: Ung Ju LEE, Seung Gi YANG, Ye Eun JEONG, Sung Pil YOON, Hyo Seok PARK
  • Patent number: 11973265
    Abstract: An antenna device according to an embodiment of the present disclosure includes a dielectric layer, a first electrode layer disposed on an upper surface of the dielectric layer, the first electrode layer including a radiator and having a first mesh structure, and a second electrode layer disposed on a lower surface of the dielectric layer, the second electrode layer having a second mesh structure. The first mesh structure and the second mesh structure are aligned to be offset or staggered from each other with respect to the dielectric layer in a planar view.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: April 30, 2024
    Assignee: DONGWOO FINE-CHEM CO., LTD.
    Inventors: Han Sub Ryu, Dong Pil Park, Yun Seok Oh
  • Publication number: 20240123370
    Abstract: An ion filter for circulating coolant in a fuel cell stack of a fuel cell vehicle includes a housing including an inlet configured so that a fluid is introduced and an outlet configured so that the fluid is discharged, a filter element accommodated in the housing to filter the fluid, a valve assembly provided on the inlet and configured to operate the flow of the fluid introduced into the housing through the inlet to be allowed or blocked, and a gate member provided in the housing and configured to adjust an operation of the valve assembly.
    Type: Application
    Filed: March 2, 2023
    Publication date: April 18, 2024
    Inventors: Kyeong Jun BAEK, Sun Ae Park, Hun Woo Park, Hyung Geun Cho, Young Sang Cho, Sang Pil Byun
  • Patent number: 11957709
    Abstract: The present disclosure relates to a nanoemulsion composition of oxygen gas sustained release and method for preparing the same, and provides a nanoemulsion composition of oxygen gas sustained release and method for preparing the same, including a water phase part containing water, and an oil phase part dispersed in the water phase part and made of nanoparticle containing a perfluorocarbon compound, wherein the oil phase part contains oxygen gas, and the oxygen gas is released in sustained release. According to the present disclosure, there are advantages of preventing hair loss or promoting hair growth by increasing the amount of oxygen gas supplied to the hair bulb and the oxygen release time from the hair bulb.
    Type: Grant
    Filed: June 23, 2022
    Date of Patent: April 16, 2024
    Assignees: AMOREPACIFIC CORPORATION, CHOSUN NATIONAL UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Phil June Park, Jun-pil Jee, Bongsoo Pi, Haewon Jeong, Hyoung June Kim, Dalsu Na, Wonseok Park
  • Patent number: 11952372
    Abstract: Provided is a tribenzazole amine derivative represented by Formula 1 that effectively absorbs high energy UV light from an external light source to minimize damage to organic materials present in an organic electroluminescent device, contributing to a substantial improvement in the lifetime of the organic electroluminescent device. Also provided is an organic electroluminescent device using the tribenzazole amine derivative. The organic electroluminescent device includes a first electrode, a second electrode, and an organic layer arranged between the first and second electrodes. The organic layer includes the tribenzazole amine derivative.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: April 9, 2024
    Assignee: LAPTO CO., LTD.
    Inventors: Moon-ki Seok, Byung-soo Go, Chul-soo Lim, Hyun-a Kim, Kyou-sic Kim, Yong-pil Park, Kap-jong Han, Eu-gene Oh
  • Patent number: 11955693
    Abstract: An antenna package according to an embodiment of the present disclosure includes a first antenna device including a first antenna unit, a first circuit board electrically connected to the first antenna unit, a second circuit board electrically connected to the first circuit board, a second antenna unit integrated with the second circuit board, and an antenna driving integrated circuit chip mounted on the second circuit board and electrically connected to the first antenna unit and the second antenna unit. Multi-axial radiation is implemented using the antenna package with high efficiency and reliability.
    Type: Grant
    Filed: January 6, 2022
    Date of Patent: April 9, 2024
    Assignee: DONGWOO FINE-CHEM CO., LTD.
    Inventors: Byung Jin Choi, Na Yeon Kim, Han Sub Ryu, Dong Pil Park
  • Patent number: 11945864
    Abstract: A monoclonal antibody or an antigen-binding fragment thereof according to an embodiment of the present invention can bind to lymphocyte-activation gene 3 (LAG-3) including a heavy chain variable region and a light chain variable region and inhibit the activity thereof. Thus it is expected to be useful for the development of immunotherapeutic agents for various disorders that are associated with LAG-3.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: April 2, 2024
    Assignee: Y-BIOLOGICS INC.
    Inventors: Sang Pil Lee, Ji-Young Shin, Sunha Yoon, Yunseon Choi, Jae Eun Park, Ji Su Lee, Youngja Song, Gisun Baek, Seok Ho Yoo, Yeung-chul Kim, Dong Jung Lee, Bum-Chan Park, Young Woo Park
  • Patent number: 11948873
    Abstract: A semiconductor package including: a first substrate; a first semiconductor device on the first substrate; a first mold layer covering the first semiconductor device; a second substrate on the first mold layer; a support solder ball interposed between the first substrate and the second substrate, and electrically disconnected from the first substrate or the second substrate, wherein the support solder ball includes a core and is disposed near a first sidewall of the first semiconductor device; and a substrate connection solder ball disposed between the first sidewall of the first semiconductor device and the support solder ball to electrically connect the first substrate to the second substrate, wherein a top surface of the first semiconductor device has a first height from a top surface of the first substrate, and the core has a second height which is equal to or greater than the first height.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: April 2, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jeonghyun Lee, Dongwook Kim, Hwan Pil Park, Jongbo Shim
  • Publication number: 20240085208
    Abstract: An augmented reality (AR)-based route guidance method includes acquiring a driving image captured by an image capturing device of a vehicle which is running, acquiring route data to a destination of the vehicle, recognizing both side lane markings of a lane in which the vehicle is running from the acquired driving image, generating first route guidance linear data based on the recognized both side lane markings for a region in which both side lane markings are recognized in the driving image, generating second route guidance linear data using link linear data of the route data for a region in which both side lane markings are not recognized in the driving image, combining the first route guidance linear data and the second route guidance linear data to generate combined route guidance linear data, and displaying a route guidance object in AR using the generated combined route guidance linear data.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Applicant: THINKWARE CORPORATION
    Inventors: Suk Pil Ko, Shin Hyoung Kim, Yo Sep Park
  • Publication number: 20240075853
    Abstract: An apparatus of tilting a seat cushion of a vehicle, includes a tilting motor, a pinion gear, a sector gear, and a tilting link which perform the tilting operation of the seat cushion and exert a binding force in a tilted state of the seat cushion and are provided to be connected to both of one side and the other side of a seat cushion frame, and has two sector gears positioned on left and right sides and connected to each other by a connection bar so that, by strengthening a binding force of the front portion of the seat cushion, it is possible to secure the safety of passengers in the event of a collision.
    Type: Application
    Filed: April 13, 2023
    Publication date: March 7, 2024
    Applicants: Hyundai Motor Company, Kia Corporation, DAS CO., LTD, Faurecia Korea, Ltd., Hyundai Transys Inc.
    Inventors: Sang Soo LEE, Mu Young KIM, Sang Hark LEE, Ho Suk JUNG, Sang Do PARK, Chan Ho JUNG, Dong Hoon LEE, Hea Yoon KANG, Deok Soo LIM, Seung Pil JANG, Seon Ho KIM, Jong Seok YUN, Hyo Jin KIM, Dong Gyu SHIN, Jin Ho SEO, Young Jun KIM, Taek Jun NAM
  • Publication number: 20240075798
    Abstract: Disclosed is a vehicle battery case including: a case body in which a vehicle battery is contained; and a side portion extending in a longitudinal direction of a vehicle and coupled to a side of the case body, thereby protecting a side of the vehicle battery. The side portion includes: a lower panel extending outwards from the case body and having multiple first protrusions formed to protrude upwards; an upper panel disposed above the lower panel and extending outwards from the case body so as to form a closed section together with the lower panel; and a reinforcement panel disposed between the upper panel and the lower panel so as to extend outwards from the case body, thereby reinforcing rigidity of the side portion together with the lower panel and the upper panel.
    Type: Application
    Filed: March 2, 2023
    Publication date: March 7, 2024
    Applicants: Hyundai Motor Company, Kia Corporation, HYUNDAI STEEL COMPANY, SEOJIN INDUSTRIAL Co., Ltd.
    Inventors: Sung Ho YOON, Uk HEO, Han Young HWANG, Sang Pil PARK
  • Patent number: 11908806
    Abstract: A semiconductor package includes a first substrate that includes a first insulating layer, a ground pattern in the first insulating layer, and a first conductive pattern; a first semiconductor chip placed on an upper surface of the first substrate; a ball array structure that is placed on the upper surface of the first substrate along a perimeter of the first semiconductor chip and is electrically connected to the ground pattern; and a shielding structure placed on the upper surface of the first semiconductor chip and in contact with the upper surface of the ball array structure. The ball array structure has a closed loop shape, and includes a solder ball portion and a connecting portion that connects adjacent solder ball portions. A maximum width of the solder ball portion is greater than a width of the connecting portion in a direction perpendicular to an extension direction of the connecting portion.
    Type: Grant
    Filed: October 14, 2021
    Date of Patent: February 20, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong Ho Kim, Ji Hwang Kim, Hwan Pil Park, Jong Bo Shim
  • Publication number: 20240055405
    Abstract: A semiconductor package includes a substrate, a first chip stack on the substrate and including a first semiconductor chip, an underfill pattern on a first side of the first chip stack, and a second chip stack on the first chip stack and including a second semiconductor chip. The second chip stack is stacked so as to be offset to the first chip stack. The first chip stack includes a first adhesive layer under the first semiconductor chip and a first chip protection structure on the first semiconductor chip. The second chip stack includes a second adhesive layer under the second semiconductor chip and a second chip protection structure on the second semiconductor chip. An extension portion of the second adhesive layer is on one side of the first chip protection structure, and the underfill pattern extends from the first side of the first chip stack to the extension portion.
    Type: Application
    Filed: April 17, 2023
    Publication date: February 15, 2024
    Inventors: Joo-Young OH, Hwan Pil PARK
  • Patent number: 11889139
    Abstract: An apparatus for controlling a display includes a controller to set a relationship index indicating relationship between selected content, which is selected through an input of a user, of the at least one content, and remaining content of the at least one content, and arrange an output screen of the output device, based on the relationship index, such that content useful to a user as well as content desired by the user is determined and provided, thereby improving the convenience of the user.
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: January 30, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Tae Ho Lee, Mun Jun Hur, Jong Pil Park, Kwang Seung Heo, Kyowoong Choo
  • Patent number: 11881599
    Abstract: A current interrupt device, which may be included in a battery module, includes first and second connection parts each having one surface on which an inclined surface is formed; wherein the inclined surface of the first connection part and the inclined surface of the second connection part contact each other to form a contact interface, the first connection part and the second connection part are electrically connected to each other, and when an external force equal to or greater than a predetermined force is applied to the inclined surface of the first connection part or the inclined surface of the second connection part, the inclined surface of the first connection part and the inclined surface of the second connection part are dislocated with respect to each other on the contact interface to interrupt electrical connection between the first connection part and the second connection part.
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: January 23, 2024
    Inventors: Kyoung Ho Kim, Song Taek Oh, Jung Seok Choi, Jong Pil Park
  • Patent number: 11876083
    Abstract: Provided is a semiconductor package comprising a lower package that includes a lower substrate and a lower semiconductor chip, an interposer substrate on the lower package and having a plurality of holes that penetrate the interposer substrate, a thermal radiation structure that includes a supporter on a top surface of the interposer substrate and a plurality of protrusions in the holes of the interposer substrate, and a thermal conductive layer between the lower semiconductor chip and the protrusions of the thermal radiation structure.
    Type: Grant
    Filed: August 20, 2021
    Date of Patent: January 16, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dongho Kim, Ji Hwang Kim, Hwan Pil Park, Jongbo Shim
  • Patent number: 11870150
    Abstract: An antenna package according to an exemplary embodiment of the present invention includes a first antenna device which includes a first antenna unit including a first radiator, a second antenna device which includes a second antenna unit including a second radiator whose polarization direction is perpendicular to the first radiator, a first circuit board electrically connected with the first antenna unit, a second circuit board electrically connected with the second antenna unit, and a third circuit board on which at least one antenna driving integrated circuit (IC) chip electrically and independently connected to the first circuit board and the second circuit board is mounted. By supplying power to two antenna devices having different polarization directions, respectively, signal interference and signal loss may be prevented, and dual polarization may be implemented.
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: January 9, 2024
    Assignee: DONGWOO FINE-CHEM CO., LTD.
    Inventors: Young Ju Kim, Dong Pil Park, Byung Jin Choi, Han Sub Ryu, Ho Dong Yoon
  • Patent number: 11854989
    Abstract: A semiconductor package substrate includes a substrate having a bottom surface including a cavity structure defined therein. The cavity structure includes a floor surface. A passive device structure has at least a partial portion of the passive device structure disposed in the cavity structure. The passive device structure includes a first passive device and a second passive device that are each electrically connected to the floor surface of the cavity structure. At least partial portions of the first passive device and the second passive device vertically overlap each other.
    Type: Grant
    Filed: February 4, 2021
    Date of Patent: December 26, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dongho Kim, Jongbo Shim, Hwan Pil Park, Choongbin Yim, Jungwoo Kim
  • Patent number: 11848484
    Abstract: An antenna structure according to an embodiment of the present disclosure includes a dielectric layer, and an antenna unit disposed on a top surface of the dielectric layer. The antenna unit includes a radiator including convex portions and concave portions, a transmission line including a first transmission line and a second transmission line that extend in different directions to be connected to the radiator, and a parasitic element disposed to be adjacent to the transmission line and electrically and physically separated from the transmission line and the radiator. A length of the parasitic element in an extension direction of the transmission line is from 45% to 70% of a half wavelength (?/2) at a maximum resonance frequency from the antenna unit.
    Type: Grant
    Filed: July 5, 2022
    Date of Patent: December 19, 2023
    Assignees: DONGWOO FINE-CHEM CO., LTD., KREEMO INC.
    Inventors: Won Hee Lee, Dong Pil Park, Young Sub Son, In Seok Jang, Beak Jun Seong, Jung Woo Lee, Seong Tae Jeong, In Kyung Hong, John Joonho Park