Patents by Inventor Pil Seung Kang

Pil Seung Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and manufacturing method thereof
    Patent number: 10395972
    Abstract: A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes: a deep trench in a substrate; a sidewall insulating film on a side surface of the deep trench; an interlayer insulating film on the sidewall insulating film; and an air gap in the interlayer insulating film.
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: August 27, 2019
    Assignee: MagnaChip Semiconductor, Ltd.
    Inventors: Da Soon Lee, Hyung Suk Choi, Jeong Gyu Park, Gil Ho Lee, Hyun Tae Jung, Meng An Jung, Woo Sig Min, Pil Seung Kang
  • SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    Publication number: 20180166322
    Abstract: A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes: a deep trench in a substrate; a sidewall insulating film on a side surface of the deep trench; an interlayer insulating film on the sidewall insulating film; and an air gap in the interlayer insulating film.
    Type: Application
    Filed: January 16, 2018
    Publication date: June 14, 2018
    Applicant: MagnaChip Semiconductor, Ltd.
    Inventors: Da Soon LEE, Hyung Suk CHOI, Jeong Gyu PARK, Gil Ho LEE, Hyun Tae JUNG, Meng An JUNG, Woo Sig MIN, Pil Seung KANG
  • Semiconductor device and manufacturing method thereof
    Patent number: 9922865
    Abstract: A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes: a deep trench in a substrate; a sidewall insulating film on a side surface of the deep trench; an interlayer insulating film on the sidewall insulating film; and an air gap in the interlayer insulating film.
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: March 20, 2018
    Assignee: Magnachip Semiconductor, Ltd.
    Inventors: Da Soon Lee, Hyung Suk Choi, Jeong Gyu Park, Gil Ho Lee, Hyun Tae Jung, Meng An Jung, Woo Sig Min, Pil Seung Kang
  • SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    Publication number: 20140291767
    Abstract: A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes: a deep trench in a substrate; a sidewall insulating film on a side surface of the deep trench; an interlayer insulating film on the sidewall insulating film; and an air gap in the interlayer insulating film.
    Type: Application
    Filed: October 30, 2013
    Publication date: October 2, 2014
    Applicant: MAGNACHIP SEMICONDUCTOR, LTD.
    Inventors: Da Soon Lee, Hyung Suk Choi, Jeong Gyu Park, Gil Ho Lee, Hyun Tae Jung, Meng An Jung, Woo Sig Min, Pil Seung Kang