Abstract: An LED packaging includes a substrate having a top surface and a bottom surface opposite to the top surface, a recess defined in the top surface, an LED mounted on the top surface of the substrate, a zener diode received in the recess, and a reflecting layer formed in the recess and enclosing the zener diode therein.

Abstract: The present disclosure provides a light emitting diode package which includes a plurality of electrodes, an LED die, a reflecting cup, a reflecting layer, and a phosphor layer. The LED die are electrically connected with the electrodes. The reflecting cup is formed on the electrodes and surrounds the LED die. The reflecting cup includes an inner surface. The reflecting layer is formed between the inner surface and LED die, and the reflecting layer has a higher pyrogenation temperature than the reflecting cup. The phosphor layer covers the LED die.

Abstract: The present invention is related to a light emitting diode (LED) package. The LED package includes a blue LED chip, a first electrode, a second electrode and a phosphor layer. The phosphor layer covers an outer periphery of the blue LED chip, except a bottom surface of the blue LED chip. The phosphor layer is mixed by yellow fluorescent powder and glue. The phosphor layer includes a main portion corresponding to a central portion of an emitting angle of the blue LED chip and an extending portion corresponding to a periphery of the emitting angle. An average thickness of the main portion is larger than the thickness of the extending portion.

Abstract: A photoelectric device includes an electrode structure, an LED (light emitting diode) element, a zener diode and a reflective cup. The LED element, the zener diode and the reflective cup are arranged on the electrode structure. The LED element and the zener diode are electrically connected in anti-parallel with each other. The reflective cup comprises an inner surface defined thereof and a nick defined in an outside of the reflective cup. The LED element is surrounded by the inner surface of the reflective cup and the zener diode is arranged in the nick.

Abstract: An LED packaging includes a substrate having a top surface and a bottom surface opposite to the top surface, a recess defined in the top surface, an LED mounted on the top surface of the substrate, a zener diode received in the recess, and a reflecting layer formed in the recess and enclosing the zener diode therein.

Abstract: An optical lens includes a first optical surface located at a bottom thereof, a third optical surface located at a top thereof and arranged oppositely to the first optical surface, and a second optical surface extending between the first optical surface and the third optical surface. The third optical surface is recessed downwardly towards the first optical surface. The light from the LED light source enters into the optical lens through the first optical surface, most of the entering light is directly refracted out of the optical lens through the second optical surface, and a part of the entering light that strikes the third optical surface is first reflected by the third optical surface towards the second optical surface via total internal reflection and then refracted out of the optical lens through the second optical surface. A backlight module incorporating the optical lens is also provided.

Abstract: A photoelectric device includes an electrode structure, an LED (light emitting diode) element, a zener diode and a reflective cup. The LED element, the zener diode and the reflective cup are arranged on the electrode structure. The LED element and the zener diode are electrically connected in anti-parallel with each other. The reflective cup comprises an inner surface defined thereof and a nick defined in an outside of the reflective cup. The LED element is surrounded by the inner surface of the reflective cup and the zener diode is arranged in the nick.

Abstract: The present disclosure provides a light emitting diode package which includes a plurality of electrodes, an LED die, a reflecting cup, and a phosphor layer. The LED die are electrically connected with the electrodes. The LED die includes a top light emitting surface and a plurality of lateral sides extending downward from the top light emitting surface. The reflecting cup is formed on the electrodes and surrounds the LED die. The reflecting cup includes an inner surface. The inner surface contacts with bottom portion of the LED die. A cavity is defined between the inner surface and other portion except the bottom portion of the LED die. The phosphor layer covers and seals the LED die.

Abstract: A flip chip light emitting diode (LED) packaging structure, including a substrate, an LED chip including a P electrode and a N electrode. A protruding platform is formed in a center of the substrate. The protruding platform includes a first connecting portion and a second connecting portion electrically insulating from each other. The P electrode and the N electrode is conductively fixed to the protruding platform by solder, and a bottom edge of the P electrode and the N electrode are beyond a top edge of the protruding platform.

Abstract: The present disclosure provides an LED package which includes electrodes, an LED die electrically connected with the electrodes, an encapsulation covering the LED die; and a casing surrounding the encapsulation and the LED die. The casing includes a base, a reflecting cup and a supporting portion. The reflecting cup extends from the base upwards, the reflecting cup surrounds the LED die, and the supporting portion is located inside the reflecting cup and across the electrodes.

Abstract: A photoelectric device includes a base, an LED (light emitting diode) element and a zener diode. The base includes a first electrode and a second electrode. The LED element and the zener diode are electrically connected with the first electrode and the second electrode. A recess structure is defined in the base. The zener diode is arranged in the recess structure. The zener diode is electrically connected in anti-parallel with the LED element.

Abstract: A flip chip light emitting diode includes a plurality of light emitting diodes and an encapsulation covering the plurality of light emitting diodes. Each of light emitting diode has a P electrode and an N electrode which are exposed out of the encapsulation.

Abstract: The present disclosure provides a light emitting diode die which includes a substrate; an N type semiconductor layer, an active layer, and a P type semiconductor layer formed on the substrate in sequence; at least one recess, and a pair of electrodes. The recess extends to the N type semiconductor layer. The insulating layer covers the all of side surfaces of the N type semiconductor layer, the active layer, the P type semiconductor layer, and covers top of the P type semiconductor layer except an opening on the P semiconductor layer. One of the electrodes is filled in the recess and electrically connected to the N type semiconductor layer, and the other one of the electrodes is connected to the P type semiconductor layer in the opening. The present disclosure further provides an LED package having the LED die and a method for manufacturing the same.

Abstract: A flip chip light emitting diode (LED) packaging structure, including a substrate, an LED chip including a P electrode and a N electrode. A protruding platform is formed in a center of the substrate. The protruding platform includes a first connecting portion and a second connecting portion electrically insulating from each other. The P electrode and the N electrode is conductively fixed to the protruding platform by solder, and a bottom edge of the P electrode and the N electrode are beyond a top edge of the protruding platform.

Abstract: An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way.

Abstract: A device for extracting at least one analyte may include: a sample reservoir configured to contain a sample comprising at least one target analyte and interfering materials; at least one extraction chamber connected to the sample reservoir; at least one porous structure lining one or more sides of the at least one extraction chamber; and a voltage source configured to provide a first voltage and a second voltage, wherein, when the first voltage is provided, the at least one target analyte and the interfering materials move towards the at least one extraction chamber or to a predetermined area from the at least one extraction chamber, wherein, when the second voltage is provided, the interfering materials pass through and exit the at least one extraction chamber, and the at least one target analyte is stopped from exiting the at least one extraction chamber by means of the at least one porous structure.

Abstract: An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way.

Abstract: A flip chip light emitting diode packaging structure includes a substrate and an LED located on the substrate. The LED includes a P electrode and a N electrode. The substrate includes a first electrode and a second electrode mounted on a top surface of the substrate. The first electrode and the second electrode have a first protrusion and a second protrusion. The P electrode and the N electrode are fixed on the top surface of the first protrusion and the second protrusion through the solder. The bottom edge of the P electrode and the N electrode is beyond the top edge of the first protrusion and the second protrusion.