Abstract: A laser slicing apparatus, in which a laser module provides a laser beam, and a light splitting element of a focusing lens set splits the laser beam into a plurality of focused laser beams to form a plurality of induce lines having first laser modified cracks in a modified layer at a predetermined depth inside a substrate. A rotating module rotates the light splitting element with an angle, and the light splitting element converts the focused laser beams according to this angle to form a plurality of modified groups between the induce lines. Each modified group includes a plurality of modified lines having second laser modified cracks, and the first laser modified cracks and the second laser modified cracks are connected to each other to form a continuous laser modified crack in the modified layer at the predetermined depth inside the substrate, thereby speeding up the laser slicing production.

Abstract: A detection device, including a substrate, a gate line, a gate line driving circuit, and a photoelectric element, is provided. The substrate includes a detection area and a peripheral area surrounding the detection area. The gate line is disposed on the substrate and extends from the detection area to the peripheral area. The gate line driving circuit is disposed in the peripheral area of the substrate and includes a first transistor and a second transistor. The first transistor is coupled to a first clock signal and the gate line. The second transistor is coupled to a second clock signal and the first transistor. The photoelectric element is disposed in the detection area and is coupled to the gate line. A distance between the second transistor and the detection area is less than a distance between the first transistor and the detection area.