Abstract: An array substrate includes a device array, a bonding pad, and at least one support structure. The bonding pad is located in a bonding area and is electrically connected to the device array. A horizontal distance between the at least one support structure and the bonding pad is between 5 ?m and 1000 ?m.

Abstract: An array substrate includes a device array, a bonding pad, and at least one support structure. The bonding pad is located in a bonding area and is electrically connected to the device array. A horizontal distance between the at least one support structure and the bonding pad is between 5 ?m and 1000 ?m.

Abstract: An active array substrate includes a flexible substrate, an inorganic barrier layer, and at least one active component. The inorganic barrier layer covers the flexible substrate. The inorganic barrier layer has a through hole therein. The through hole of the inorganic barrier layer exposes the flexible substrate. The active component is disposed on the inorganic barrier layer.

Abstract: An apparatus for taking a flexible display panel off includes a roller, a linear motion member, a fastening apparatus and a first driving apparatus. The roller has a circumferential surface which allows a first portion of the flexible display panel to be wound thereon. The linear motion member has a carrying surface. A second portion of the flexible display panel is in contact with the carrying surface. The fastening apparatus is used to fasten the flexible display panel onto the carrying surface of the linear motion member. The first driving apparatus is used to drive the linear motion member to move linearly relative to the circumferential surface, so that the first portion departs from the circumferential surface and moves onto the carrying surface along with the second portion.

Abstract: A method for fabricating flexible display module mainly includes following steps: providing a transparent carrier with a carrying-surface and a back-surface opposite to the carrying-surface; forming a photosensitive-release-film on the carrying-surface; providing a flexible substrate on the photosensitive-release-film; forming a pixel array on the flexible substrate; during or after forming the pixel array, conducting irradiation on the photosensitive-release-film from the back-surface of the transparent carrier to weaken bonding force between the photosensitive-release-film and the transparent carrier or simultaneously weaken both the bonding force between the photosensitive-release-film and the transparent carrier and the structure strength of the photosensitive-release-film; and then, removing the flexible substrate from the transparent carrier, in which at least one portion of the photosensitive-release-film is peeled off from the carrying-surface and remains on the flexible substrate.

Abstract: A method of fabricating a flexible substrate structure includes the following steps. A supporting carrier is provided, and a release layer is formed on the supporting carrier, where the release layer includes a photo-sensitive adhesive layer. A local modification process is performed to form a bonding region with adhesion property in modified parts of the release layer, and to form a release region without adhesion property in unmodified parts of the release layer. The local modification process includes performing a local exposure process with a light source to form the bonding region with adhesion property in illuminated parts of the release layer, and to form a release region without adhesion property in unilluminated parts of the release layer.

Abstract: An active array substrate includes a flexible substrate, an inorganic barrier layer, and at least one active component. The inorganic barrier layer covers the flexible substrate. The inorganic barrier layer has a through hole therein. The through hole of the inorganic barrier layer exposes the flexible substrate. The active component is disposed on the inorganic barrier layer.

Abstract: An active array substrate includes a flexible substrate, an inorganic barrier layer, and at least one active component. The inorganic barrier layer covers the flexible substrate. The inorganic barrier layer has a through hole therein. The through hole of the inorganic barrier layer exposes the flexible substrate. The active component is disposed on the inorganic barrier layer.

Abstract: An apparatus for taking a flexible display panel off includes a roller, a linear motion member, a fastening apparatus and a first driving apparatus. The roller has a circumferential surface which allows a first portion of the flexible display panel to be wound thereon. The linear motion member has a carrying surface. A second portion of the flexible display panel is in contact with the carrying surface. The fastening apparatus is used to fasten the flexible display panel onto the carrying surface of the linear motion member. The first driving apparatus is used to drive the linear motion member to move linearly relative to the circumferential surface, so that the first portion departs from the circumferential surface and moves onto the carrying surface along with the second portion.

Abstract: An active array substrate includes a flexible substrate, an inorganic barrier layer, and at least one active component. The inorganic barrier layer covers the flexible substrate. The inorganic barrier layer has a through hole therein. The through hole of the inorganic barrier layer exposes the flexible substrate. The active component is disposed on the inorganic barrier layer.

Abstract: A method of fabricating a flexible substrate structure includes the following steps. A supporting carrier is provided, and a release layer is formed on the supporting carrier, where the release layer includes a photo-sensitive adhesive layer. A local modification process is performed to form a bonding region with adhesion property in modified parts of the release layer, and to form a release region without adhesion property in unmodified parts of the release layer. The local modification process includes performing a local exposure process with a light source to form the bonding region with adhesion property in illuminated parts of the release layer, and to form a release region without adhesion property in unilluminated parts of the release layer.

Abstract: A method for fabricating flexible display module mainly includes following steps: providing a transparent carrier with a carrying-surface and a back-surface opposite to the carrying-surface; forming a photosensitive-release-film on the carrying-surface; providing a flexible substrate on the photosensitive-release-film; forming a pixel array on the flexible substrate; during or after forming the pixel array, conducting irradiation on the photosensitive-release-film from the back-surface of the transparent carrier to weaken bonding force between the photosensitive-release-film and the transparent carrier or simultaneously weaken both the bonding force between the photosensitive-release-film and the transparent carrier and the structure strength of the photosensitive-release-film; and then, removing the flexible substrate from the transparent carrier, in which at least one portion of the photosensitive-release-film is peeled off from the carrying-surface and remains on the flexible substrate.

Abstract: A flexible substrate structure includes a supporting carrier, a flexible substrate, and a release layer. The flexible substrate is disposed on the supporting carrier. The release layer is disposed between and in contact with the supporting carrier and the flexible substrate. The release layer includes a bonding region with adhesion property, the bonding region is for bonding the flexible substrate and the supporting carrier together, and a release region without adhesion property, the release region is for supporting the flexible substrate.