Abstract: An LED package structure includes a multilayer circuit board, an LED chip, and a cover. The multilayer circuit board has a conductive layer, a first resin layer disposed on the conductive layer, and a first circuit layer disposed on the first resin layer. The first resin layer has a first opening, and a portion of the conductive layer is partially exposed from the first resin layer via the first opening such that a mounting region is exposed. The first circuit layer has a second opening, and the second opening exposes the mounting region. The LED chip is fixed on the mounting region by passing it through the first and second openings, and the LED chip is connected to the first circuit layer by wires. The cover is disposed on the first resin layer and covers the LED chip and the first circuit layer.

Abstract: An LED package structure includes a multilayer circuit board, an LED chip, and a cover. The multilayer circuit board has a conductive layer, a first resin layer disposed on the conductive layer, and a first circuit layer disposed on the first resin layer. The first resin layer has a first opening, and a portion of the conductive layer is partially exposed from the first resin layer via the first opening such that a mounting region is exposed. The first circuit layer has a second opening, and the second opening exposes the mounting region. The LED chip is fixed on the mounting region by passing it through the first and second openings, and the LED chip is connected to the first circuit layer by wires. The cover is disposed on the first resin layer and covers the LED chip and the first circuit layer.

Abstract: An LED package structure includes a multilayer circuit board, an LED chip, and a cover. The multilayer circuit board has a conductive layer, a first resin layer disposed on the conductive layer, and a first circuit layer disposed on the first resin layer. The first resin layer has a first opening, and a portion of the conductive layer is partially exposed from the first resin layer via the first opening such that a mounting region is exposed. The first circuit layer has a second opening, and the second opening exposes the mounting region. The LED chip is fixed on the mounting region by passing it through the first and second openings, and the LED chip is connected to the first circuit layer by wires. The cover is disposed on the first resin layer and covers the LED chip and the first circuit layer.

Abstract: An LED package structure includes a multilayer circuit board, an LED chip, and a cover. The multilayer circuit board has a conductive layer, a first resin layer disposed on the conductive layer, and a first circuit layer disposed on the first resin layer. The first resin layer has a first opening, and a portion of the conductive layer is partially exposed from the first resin layer via the first opening such that a mounting region is exposed. The first circuit layer has a second opening, and the second opening exposes the mounting region. The LED chip is fixed on the mounting region by passing it through the first and second openings, and the LED chip is connected to the first circuit layer by wires. The cover is disposed on the first resin layer and covers the LED chip and the first circuit layer.

Abstract: A power-saving touch pad apparatus includes a control unit, a proximity sensing unit, an electric charge induction unit, a touch pad driving-operation unit, and a touch pad unit. The electric charge induction unit is formed by a sputtering process. The electric charge induction unit informs the proximity sensing unit when the electric charge induction unit inducts electric charges. The proximity sensing unit informs the control unit. The control unit is configured to control the touch pad driving-operation unit to wake up the touch pad unit. The electric charge induction unit informs the proximity sensing unit when the electric charge induction unit does not induct electric charges. The proximity sensing unit informs the control unit. The control unit is configured to control the touch pad driving-operation unit to control the touch pad unit to enter a power-saving mode.

Abstract: A touch keyboard with an improved structure is disclosed. The touch keyboard includes a keyboard casing and an inductive circuit layer. The keyboard casing has a front surface and a rear surface; the front surface has a keyboard key assembly composed of a plurality of touch keyboard keys. The touch keyboard keys are integrally formed with the keyboard casing and projected from the front surface of the keyboard casing. The inductive circuit layer is formed on the rear surface of the keyboard casing and is used to detect touching and sliding operations from the user. The touch keyboard keys are projected from the front surface of the keyboard casing so as to identify positions of the touch keyboard keys without fixing user's eyes on the keyboard and increase touching feeling.

Abstract: A power-saving touch pad apparatus includes a control unit, a proximity sensing unit, an electric charge induction unit, a touch pad driving-operation unit, and a touch pad unit. The electric charge induction unit is formed by a sputtering process. The electric charge induction unit informs the proximity sensing unit when the electric charge induction unit inducts electric charges. The proximity sensing unit informs the control unit. The control unit is configured to control the touch pad driving-operation unit to wake up the touch pad unit. The electric charge induction unit informs the proximity sensing unit when the electric charge induction unit does not induct electric charges. The proximity sensing unit informs the control unit. The control unit is configured to control the touch pad driving-operation unit to control the touch pad unit to enter a power-saving mode.

Abstract: A touch keyboard with an improved structure is disclosed. The touch keyboard includes a keyboard casing and an inductive circuit layer. The keyboard casing has a front surface and a rear surface; the front surface has a keyboard key assembly composed of a plurality of touch keyboard keys. The touch keyboard keys are integrally formed with the keyboard casing and projected from the front surface of the keyboard casing. The inductive circuit layer is formed on the rear surface of the keyboard casing and is used to detect touching and sliding operations from the user. The touch keyboard keys are projected from the front surface of the keyboard casing so as to identify positions of the touch keyboard keys without fixing user's eyes on the keyboard and increase touching feeling.