Abstract: A method for generating Bessel beams includes the steps of: utilizing a light source to generate an incident beam to a phase modulation module; utilizing the phase modulation module to rectify the incident beam into a circular beam, and to modulate a phase of the circular beam into an asymmetric phase so as to form an asymmetric collimated circular beam provided to a scanning module; utilizing the scanning module to compensate the asymmetric collimated circular beam, and utilizing the asymmetric collimated circular beam to scan at different angles and then enter a focusing element; and, utilizing the focusing element to focus and interfere the asymmetric collimated circular beam into form a Bessel beam for machining.

Abstract: A method of fabricating a substrate having a through via includes: providing a carrier board having a release layer thereon; attaching the substrate onto the carrier board via the release layer; applying a light beam to the substrate to form a first blind hole in the substrate, wherein the first blind hole penetrates a first surface and a second surface of the substrate; performing an enlargement process on the first blind hole to form a second blind hole; forming a through via in the second blind hole; and performing a de-bonding process to release the substrate having a through via from the carrier board.

Abstract: An adjustment method of laser light path includes the steps of: having a laser light path to penetrate through a measuring device to obtain at least two laser focal positions of the laser light path, the at least two laser focal positions forming an arc path; applying a focal position-calculating device to calculate coordinate values of the at least two laser focal positions; based on the arc path and the coordinate values of the at least two laser focal positions to apply the focal position-calculating device to calculate a target laser focal position; and, based on the target laser focal position to apply a light modulator to adjust each of the at least two laser focal positions to the target laser focal position. In addition, an adjustment device of laser light path is also provided.

Abstract: A method of fabricating a substrate having a through via includes: providing a carrier board having a release layer thereon; attaching the substrate onto the carrier board via the release layer; applying a light beam to the substrate to form a first blind hole in the substrate, wherein the first blind hole penetrates a first surface and a second surface of the substrate; performing an enlargement process on the first blind hole to form a second blind hole; forming a through via in the second blind hole; and performing a de-bonding process to release the substrate having a through via from the carrier board.

Abstract: A laser processing system for a glass workpiece comprises a frame with a first laser module thereon, a modifying device, and a blanking device. The blanking device comprises a second laser module, a hollow support element, a clamping module disposed on the frame, a heater disposed on the hollow support element, and a cooler connected to the clamping module. A method adapted to the system comprises a modifying process, a determining process, and a blanking process. In the modifying process, a first laser beam is irradiated to the glass workpiece along a processing contour line to intermittently modify the glass workpiece. According to the determining process, the blanking process is processed to have a crack being generated in a modified portion of the glass workpiece, wherein the crack divides the glass workpiece into an outer area and an inner area, and changes a temperature of the glass workpiece to have the glass workpiece being deformed, so that the outer area and the inner area are separated.

Abstract: A laser uniformly machining apparatus and method thereof are provided. The apparatus includes a laser unit, a shaping element, a collimating element, a scaling element and a focusing element. The laser unit provides a laser beam for machining. The shaping element shapes the laser beam into an annular beam. The collimating element modifies the direction of the annular beam in accordance with the direction of an optical axis to turn the annular beam into a collimated annular beam. The scaling element adjusts the collimated annular beam in accordance with a scaling ratio to produce a scaled annular beam. The focusing element focuses the scaled annular beam. The scaled annular beam is produced by the scaling element to form a focused beam having a uniformly distribution of light intensity in the direction of the optical axis.

Abstract: A light emitting method includes passing a laser beam through at least one offset assembly and a focusing assembly in sequence, and actuating, by a control-manipulating mechanism, the offset assembly to cause the laser beam to be offset, so that the laser beam can quickly produce a controllable opening of any shape in a drilling process.

Abstract: A light emitting method includes passing a laser beam through at least one offset assembly and a focusing assembly in sequence, and actuating, by a control-manipulating mechanism, the offset assembly to cause the laser beam to be offset, so that the laser beam can quickly produce a controllable opening of any shape in a drilling process.

Abstract: A laser uniformly machining apparatus and method thereof are provided. The apparatus includes a laser unit, a shaping element, a collimating element, a scaling element and a focusing element. The laser unit provides a laser beam for machining. The shaping element shapes the laser beam into an annular beam. The collimating element modifies the direction of the annular beam in accordance with the direction of an optical axis to turn the annular beam into a collimated annular beam. The scaling element adjusts the collimated annular beam in accordance with a scaling ratio to produce a scaled annular beam. The focusing element focuses the scaled annular beam. The scaled annular beam is produced by the scaling element to form a focused beam having a uniformly distribution of light intensity in the direction of the optical axis.

Abstract: A laser machining system and a method thereof are disclosed. The disclosed laser machining system comprises a laser generator, an array photo detector, a processer, and a position controller. The laser generator is configured to emit laser via a first light path onto a work piece. The array photo detector is configured to receive the thermal radiation from the work piece via a second light path, different from the first light path, to generate a thermal radiation image. The processor, electrically coupled to the laser generator and the array photo detector, is configured to calculate a temperature centroid of the thermal radiation image and generate a distance control signal according to the temperature centroid. The position controller, electrically coupled to the processor, is controlled by the distance control signal to make a present distance between the laser machining system equal to a working distance.

Abstract: A laser machining system and a method thereof are disclosed. The disclosed laser machining system comprises a laser generator, an array photo detector, a processer, and a position controller. The laser generator is configured to emit laser via a first light path onto a work piece. The array photo detector is configured to receive the thermal radiation from the work piece via a second light path, different from the first light path, to generate a thermal radiation image. The processor, electrically coupled to the laser generator and the array photo detector, is configured to calculate a temperature centroid of the thermal radiation image and generate a distance control signal according to the temperature centroid. The position controller, electrically coupled to the processor, is controlled by the distance control signal to make a present distance between the laser machining system equal to a working distance.

Abstract: An automatic focusing apparatus and a method thereof are provided. The apparatus includes a light source, an optical imaging unit, a photo-sensor and a focusing regulation unit. The optical imaging unit includes an object lens and a beam splitter. The beam splitter divides a reflecting beam into a first sub-beam and a second sub-beam. The optical imaging unit has a first imaging optical path and a second imaging optical path with different imaging precisions corresponding to the first sub-beam and the second sub-beam, respectively. The photo-sensor detects a defocus position of the object. The focusing regulation unit adjusts the distance between the object and the object lens and selects an imaging precision, so that the defocus position of the object is placed within the imaging precision of the first optical path and the imaging precision of the second optical path in sequence.

Abstract: An auto-focusing apparatus with timing-sequential light spots includes a light source, a lens, a timing-sequential light dividing module, a focusing element and a processing module. The light source produces an incident beam. The lens collimates the incident beam that is an unsymmetrical beam relative to the lens to a collimation beam. The timing-sequential light dividing module divides the collimation beam into multiple sub-beams in timing sequence. The focusing element focuses the sub-beams to an observed object. The processing module senses energy distribution of multiple reflected beams of the observed object corresponding to the sub-beams to accordingly calculate energy centroids of the reflected beams.

Abstract: A focal position detecting apparatus, for detecting a focusing condition and a tilting condition of an object, includes a planar beam generating module, an optical system, an optical sensor and a cylindrical lens. The planar beam generating module generates a planar light beam along a first path. The optical system is disposed on the first path, wherein the planar light beam, reflected by the object, passes through the optical system along a second path. The optical sensor is disposed on the second path. The cylindrical lens is disposed on the second path between the optical system and the optical sensor and an axis of the cylindrical lens is perpendicular to the second path. The planar light beam passes through the optical system and the cylindrical lens along the second path, before it is incident on the optical sensor to form a linear light spot for determining defocusing degree.

Abstract: An automatic focusing apparatus and a method thereof are provided. The apparatus includes a light source, an optical imaging unit, a photo-sensor and a focusing regulation unit. The optical imaging unit includes an object lens and a beam splitter. The beam splitter divides a reflecting beam into a first sub-beam and a second sub-beam. The optical imaging unit has a first imaging optical path and a second imaging optical path with different imaging precisions corresponding to the first sub-beam and the second sub-beam, respectively. The photo-sensor detects a defocus position of the object. The focusing regulation unit adjusts the distance between the object and the object lens and selects an imaging precision, so that the defocus position of the object is placed within the imaging precision of the first optical path and the imaging precision of the second optical path in sequence.

Abstract: A method of focus and a focusing apparatus and a detecting module are provided. The detecting module includes an ellipse curved-surface reflection device and a light detector. The ellipse curved-surface reflection device has a beam gate, a first focus and a second focus. A light beam is focused by a light focusing device, and is projected on a surface of an object to be detected through the beam gate. The ellipse curved-surface reflection device reflects the light beams reflected or scattered by the object. The light detector is disposed on the second focus for receiving the light beam reflected by the ellipse curved-surface reflection device to generate a detecting result, by which a distance between the light focusing device and the surface of the object to be detected is adjusted, so that the light beam is correctly focused on the surface of the object.

Abstract: A focal position detecting apparatus, for detecting a focusing condition and a tilting condition of an object, includes a planar beam generating module, an optical system, an optical sensor and a cylindrical lens. The planar beam generating module generates a planar light beam along a first path. The optical system is disposed on the first path, wherein the planar light beam, reflected by the object, passes through the optical system along a second path. The optical sensor is disposed on the second path. The cylindrical lens is disposed on the second path between the optical system and the optical sensor and an axis of the cylindrical lens is perpendicular to the second path. The planar light beam passes through the optical system and the cylindrical lens along the second path, before it is incident on the optical sensor to form a linear light spot for determining defocusing degree.

Abstract: A method of focus and a focusing apparatus and a detecting module are provided. The detecting module includes an ellipse curved-surface reflection device and a light detector. The ellipse curved-surface reflection device has a beam gate, a first focus and a second focus. A light beam is focused by a light focusing device, and is projected on a surface of an object to be detected through the beam gate. The ellipse curved-surface reflection device reflects the light beams reflected or scattered by the object. The light detector is disposed on the second focus for receiving the light beam reflected by the ellipse curved-surface reflection device to generate a detecting result, by which a distance between the light focusing device and the surface of the object to be detected is adjusted, so that the light beam is correctly focused on the surface of the object.